Low-activation energy silicon-containing resist system
    1.
    发明授权
    Low-activation energy silicon-containing resist system 失效
    低活化能含硅抗蚀剂体系

    公开(公告)号:US06939664B2

    公开(公告)日:2005-09-06

    申请号:US10693199

    申请日:2003-10-24

    摘要: Inventive silsesquioxane polymers are provided, and resist compositions that contain such silsesquioxane polymers are provided in which at least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silisesquioxane polymer contains pendant solubility inhibiting acid-labile moieties that have low activation energy for acid-catalyzed cleaving, and the presence of high optical density moieties are minimized or avoided. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive resist compositions. The invention encompasses methods of using such resist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g. bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193 nm and 157 nm.

    摘要翻译: 提供了本发明的倍半硅氧烷聚合物,并且提供了含有这种倍半硅氧烷聚合物的抗蚀剂组合物,其中至少一部分倍半硅氧烷聚合物含有氟化部分,并且至少一部分硅烷倍半硅氧烷聚合物含有侧链溶解性抑制酸不稳定部分, 用于酸催化裂解的活化能和高光密度部分的存在被最小化或避免。 本发明的聚合物还含有侧链极性部分,其促进抗蚀剂在碱性水溶液中的碱溶性。 本发明的聚合物在正性抗蚀剂组合物中特别有用。 本发明包括使用这种抗蚀剂组合物在基底上形成图案化结构的方法,特别是多层(例如双层)光刻方法,该方法能够在诸如193nm和157nm的波长下产生高分辨率图像。