Invention Grant
- Patent Title: System for mounting electronic device
- Patent Title (中): 电子装置安装系统
-
Application No.: US10030293Application Date: 2001-04-26
-
Publication No.: US06964093B2Publication Date: 2005-11-15
- Inventor: Kazuhisa Mochida , Katsumi Togasaki , Katsumi Morita , Yusuke Masutani , Hiroji Kameda , Noboru Sekiguchi , Minoru Shimada , Toshio Toyama , Akihiro Koga , Mitsuo Inoue , Kazuhiro Abe , Tetsuya Yonemoto , Kenji Ishihara , Syunji Aoki , Fumio Matsumoto , Takanori Arai , Hisashi Naoshima
- Applicant: Kazuhisa Mochida , Katsumi Togasaki , Katsumi Morita , Yusuke Masutani , Hiroji Kameda , Noboru Sekiguchi , Minoru Shimada , Toshio Toyama , Akihiro Koga , Mitsuo Inoue , Kazuhiro Abe , Tetsuya Yonemoto , Kenji Ishihara , Syunji Aoki , Fumio Matsumoto , Takanori Arai , Hisashi Naoshima
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agent Jay H. Maioli
- Priority: JP2000-13293 20000427
- International Application: PCT/JP01/03654 WO 20010426
- International Announcement: WO01/84895 WO 20011108
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H05K3/12 ; H05K3/34 ; H05K13/04 ; B23K31/02
Abstract:
An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.
Public/Granted literature
- US20020133937A1 System for mounting electronic device Public/Granted day:2002-09-26
Information query
