Invention Grant
- Patent Title: Testing arrangement to distribute integrated circuits
- Patent Title (中): 集成电路分布测试方案
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Application No.: US10278021Application Date: 2002-10-23
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Publication No.: US07112979B2Publication Date: 2006-09-26
- Inventor: Tawfik Arabi , Hung-Piao Ma , Gregory M. Iovino , Shai Rotem , Avner Kornfeld , Gregory F. Taylor
- Applicant: Tawfik Arabi , Hung-Piao Ma , Gregory M. Iovino , Shai Rotem , Avner Kornfeld , Gregory F. Taylor
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
Arrangements having integrated circuit (IC) voltage and thermal resistance designated on a per IC basis.
Public/Granted literature
- US20040082086A1 Arrangements having IC voltage and thermal resistance designated on a per IC basis Public/Granted day:2004-04-29
Information query
