发明授权
- 专利标题： Light emitting diode component
- 专利标题（中）： 发光二极管组件
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申请号： US10831862申请日： 2004-04-26
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公开(公告)号： US07224000B2公开(公告)日： 2007-05-29
- 发明人: Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
- 申请人： Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
- 申请人地址： US OH Valley View
- 专利权人： Lumination, LLC
- 当前专利权人： Lumination, LLC
- 当前专利权人地址： US OH Valley View
- 代理机构： Fay Sharpe LLC
- 主分类号： H01L29/22
- IPC分类号： H01L29/22 ; H01L29/227 ; H01L27/15 ; H01L29/267 ; H01L29/24
摘要：
A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
公开/授权文献
- US20050239227A1 Light emitting diode component 公开/授权日：2005-10-27