公开(公告)号：US07224000B2

公开(公告)日：2007-05-29

申请号：US10831862

申请日：2004-04-26

申请人： Srinath K. Aanegola ,  James T. Petroski ,  Emil Radkov ,  Stanton E. Weaver, Jr.

发明人： Srinath K. Aanegola ,  James T. Petroski ,  Emil Radkov ,  Stanton E. Weaver, Jr.

IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L27/15 ,  H01L29/267 ,  H01L29/24

CPC分类号： H01L33/52 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00

摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

摘要翻译： 发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410） ，14,16,212,412）。 透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。 与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。 密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

公开(公告)号：US09944519B2

公开(公告)日：2018-04-17

申请号：US13424835

申请日：2012-03-20

申请人： Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, Jr. ,  James T. Petroski ,  Zena Brown

发明人： Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, Jr. ,  James T. Petroski ,  Zena Brown

IPC分类号： F21V3/00 ,  B82Y10/00 ,  F21V29/70 ,  F21V29/02 ,  F21V29/58 ,  F21K9/23 ,  F21K9/232 ,  F21K9/64 ,  F21Y105/00 ,  F21V29/63 ,  F21K9/61 ,  F21Y115/10

CPC分类号： B82Y10/00 ,  F21K9/23 ,  F21K9/232 ,  F21K9/61 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/58 ,  F21V29/63 ,  F21V29/70 ,  F21V29/773 ,  F21Y2105/00 ,  F21Y2105/18 ,  F21Y2115/10

摘要： A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

公开(公告)号：US06799864B2

公开(公告)日：2004-10-05

申请号：US10063924

申请日：2002-05-24

申请人： Christopher L. Bohler ,  Anthony D. Pollard ,  Greg E. Burkholder ,  James T. Petroski ,  Mathew L. Sommers ,  Robert F. Karlicek, Jr. ,  Stanton E. Weaver, Jr. ,  Charles A. Becker

发明人： Christopher L. Bohler ,  Anthony D. Pollard ,  Greg E. Burkholder ,  James T. Petroski ,  Mathew L. Sommers ,  Robert F. Karlicek, Jr. ,  Stanton E. Weaver, Jr. ,  Charles A. Becker

IPC分类号： F21V2900

CPC分类号： F21V29/74 ,  F21K9/233 ,  F21V7/0083 ,  F21V7/041 ,  F21V7/06 ,  F21V19/0005 ,  F21V29/004 ,  F21V29/767 ,  F21V29/773 ,  F21V29/81 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

摘要： A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

摘要翻译： 光模块包括限定前侧发光二极管阵列和后侧的发光二极管组件。 后侧与导热散热器热连通，并且导热芯与导电吊具热连通。 导热芯包括与前侧发光二极管阵列可操作地连通的电导体和围绕导热芯设置的多个附件，使得它们与导电吊具热连通。

公开(公告)号：US07717591B2

公开(公告)日：2010-05-18

申请号：US11965686

申请日：2007-12-27

申请人： Stanton E. Weaver, Jr. ,  James Reginelli

发明人： Stanton E. Weaver, Jr. ,  James Reginelli

IPC分类号： F21V1/00 ,  F21V7/00 ,  F21V11/00

CPC分类号： H05K3/28 ,  F21K9/64 ,  H05K3/285 ,  H05K2201/015 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/4913

摘要： A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.

摘要翻译： 一种发光装置，包括一个其上设有电路的支撑体，至少一个安装在该支架上并与该电路电气连通的发光二极管（LED）芯片，以及与该至少一个芯片相邻的该支撑件上的反射层。

公开(公告)号：US07179670B2

公开(公告)日：2007-02-20

申请号：US10794935

申请日：2004-03-05

申请人： Bryan S. Shelton ,  Sebastien Libon ,  Hari S. Venugopalan ,  Ivan Eliashevich ,  Stanton E. Weaver, Jr. ,  Chen-Lun Hsing Chen ,  Thomas F. Soules ,  Steven LeBoeuf ,  Stephen Arthur

发明人： Bryan S. Shelton ,  Sebastien Libon ,  Hari S. Venugopalan ,  Ivan Eliashevich ,  Stanton E. Weaver, Jr. ,  Chen-Lun Hsing Chen ,  Thomas F. Soules ,  Steven LeBoeuf ,  Stephen Arthur

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L24/81 ,  H01L33/38 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05005 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/3003 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/8321 ,  H01L2224/8323 ,  H01L2224/83815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

摘要翻译： 发光二极管（10）具有背面和前侧，具有至少一个n型电极（14）和设置在其上的至少一个p型电极（12），其限定最小电极间隔（d < ）。 接合焊盘层（50）包括至少一个n型接合焊盘（64）和至少一个限定最小接合焊盘间隔（p>焊盘）的p型接合焊盘（62） 大于最小电极分离（d _{电极）。 插入在发光二极管（10）的前侧和接合焊盘层（50）之间的至少一个扇形层（30）包括穿过电介质层的通孔（34,54）的多个导电路径 以在所述至少一个n型电极（14）和所述至少一个n型焊盘（64）之间以及所述至少一个p型电极（12）和所述至少一个p型电极（12）之间提供电连通 一个p型接合焊盘（62）。}

公开(公告)号：US5366906A

公开(公告)日：1994-11-22

申请号：US962000

申请日：1992-10-16

申请人： Robert J. Wojnarowski ,  Constantine A. Neugebauer ,  Wolfgang Daum ,  Bernard Gorowitz ,  Eric J. Wildi ,  Michael Gdula ,  Stanton E. Weaver, Jr. ,  Anthony A. Immorlica, Jr.

发明人： Robert J. Wojnarowski ,  Constantine A. Neugebauer ,  Wolfgang Daum ,  Bernard Gorowitz ,  Eric J. Wildi ,  Michael Gdula ,  Stanton E. Weaver, Jr. ,  Anthony A. Immorlica, Jr.

IPC分类号： G01R31/3185 ,  H01L21/301 ,  H01L21/66 ,  H01L23/538 ,  H01L23/58 ,  G01R31/26

CPC分类号： H01L22/22 ,  H01L22/32 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  G01R31/318505 ,  G01R31/318533 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351

摘要： In fabricating wafer scale integrated interconnects, a temporary or permanent dielectric layer and a pattern of electrical conductors are used to provide wafer scale integration or testing and burn-in. A resist can be used to cover the areas of IC pads on the wafer while the remainder of the pattern of electrical conductors is removed to provide for repair of the wafer scale integration structure. The pattern of electrical conductors may be configured so that the conductor lengths between at least some sub-circuits on a plurality of wafers are substantially electrically equal for signal propagation purposes; an additional wafer may be laminated to the wafer using an adhesive; controlled curfs may be cut into the wafer; and the wafer may be interconnected to an interface ring.

摘要翻译： 在制造晶片级集成互连件时，使用临时或永久的电介质层和电导体图案来提供晶片级整合或测试和老化。 可以使用抗蚀剂来覆盖晶片上的IC焊盘的区域，而去除电导体图案的其余部分以提供晶片级整合结构的修复。 电导体的图案可以被配置为使得在多个晶片上的至少一些子电路之间的导体长度对于信号传播目的而基本上是电相等的; 可以使用粘合剂将另外的晶片层压到晶片上; 受控的曲折可以被切入晶片; 并且晶片可以互连到接口环。

公开(公告)号：US5161093A

公开(公告)日：1992-11-03

申请号：US546959

申请日：1990-07-02

申请人： Thomas B. Gorczyca ,  Stanton E. Weaver, Jr. ,  Robert J. Wojnarowski

发明人： Thomas B. Gorczyca ,  Stanton E. Weaver, Jr. ,  Robert J. Wojnarowski

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01L24/25 ,  H01L21/4857 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/3011

摘要： A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.

公开(公告)号：US20140198507A1

公开(公告)日：2014-07-17

申请号：US14083597

申请日：2013-11-19

申请人： Gary R. Allen ,  Stanton E. Weaver, Jr. ,  R. Stephen Mulder ,  David C. Dudik ,  Mark E. Kaminski

发明人： Gary R. Allen ,  Stanton E. Weaver, Jr. ,  R. Stephen Mulder ,  David C. Dudik ,  Mark E. Kaminski

IPC分类号： F21K99/00 ,  F21V13/12

CPC分类号： F21K9/233 ,  F21K9/60 ,  F21V3/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/12 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10

摘要： A directional lamp comprises a light source, a beam forming optical system configured to form light from the light source into a light beam, and a light mixing diffuser arranged to diffuse the light beam. The light source, beam forming optical system, and light mixing diffuser are secured together as a unitary lamp. The beam forming optical system includes: a collecting reflector having an entrance aperture receiving light from the light source and an exit aperture that is larger than the entrance aperture, and a lens disposed at the exit aperture of the collecting reflector, the light source being positioned along an optical axis of the beam forming optical system at a distance from the lens that is within plus or minus ten percent of a focal length of the lens.

摘要翻译： 定向灯包括光源，被配置为将光从光源形成光束的光束形成光学系统，以及布置成漫射光束的光混合漫射器。 光源，光束形成光学系统和光混合漫射器作为整体灯固定在一起。 光束形成光学系统包括：收集反射器，其具有接收来自光源的光的入射孔和大于入射孔的出射孔，以及设置在收集反射体的出射孔处的透镜，光源被定位 沿着与透镜相距一定距离的光束形成光学系统的光轴，该距离在透镜的焦距的±10％以内。

公开(公告)号：US06661167B2

公开(公告)日：2003-12-09

申请号：US10063052

申请日：2002-03-14

申请人： Ivan Eliashevich ,  Mathew L. Sommers ,  Stanton E. Weaver, Jr.

发明人： Ivan Eliashevich ,  Mathew L. Sommers ,  Stanton E. Weaver, Jr.

IPC分类号： F21V500

CPC分类号： H01L33/54 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A light emitting diode (LED) device (A) and processes for its manufacture are provided. The LED device (A) includes a light emitting chip or die (10) and an encapsulant (22) surrounding the same. The encapsulant (22) is substantially spherical in shape, and the die (10) is preferably located at a substantial center of the encapsulant (22). An electrically conductive path extends from the chip or die (10) to a periphery of the encapsulant (22) such that the chip/die (10) can be selectively energized to produce light by applying electricity to the electrically conductive path at the periphery of the encapsulant (22). Preferably, the encapsulant (22) is chosen to have an index of refraction as close as possible to the higher of an index of refraction of the die's semiconductor material and an index of refraction of the die's substrate (12).

公开(公告)号：US5279706A

公开(公告)日：1994-01-18

申请号：US959883

申请日：1992-10-13

申请人： Ernest W. Balch ,  Stanton E. Weaver, Jr. ,  William H. King ,  Bernard Gorowitz

发明人： Ernest W. Balch ,  Stanton E. Weaver, Jr. ,  William H. King ,  Bernard Gorowitz

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  H05K3/40 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/403 ,  H01L21/4846 ,  H01L23/49805 ,  H01L24/82 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/135 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/3442

摘要： A method for fabricating a metal interconnection pattern for an integrated circuit module is provided comprising the steps of: aligning only one face of the module, forming a metal layer on at least one other face of the module, applying a coating of photoresist to the metal layer, exposing predetermined portions of the photoresist to reflected radiation, and shaping the metal layer in accordance with the exposed photoresist portions.

摘要翻译： 提供了一种用于制造用于集成电路模块的金属互连图案的方法，包括以下步骤：仅对准模块的一个面，在模块的至少另一个表面上形成金属层，向金属施加光致抗蚀剂涂层 将光致抗蚀剂的预定部分暴露于反射辐射，以及根据曝光的光致抗蚀剂部分对金属层成形。