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    Light emitting diode component
    2.
    发明授权
    Light emitting diode component 有权
    发光二极管组件

    公开(公告)号：US07224000B2

    公开(公告)日：2007-05-29

    申请号：US10831862

    申请日：2004-04-26

    申请人： Srinath K. Aanegola ,  James T. Petroski ,  Emil Radkov ,  Stanton E. Weaver, Jr.

    发明人： Srinath K. Aanegola ,  James T. Petroski ,  Emil Radkov ,  Stanton E. Weaver, Jr.

    IPC分类号： H01L29/22 ,  H01L29/227 ,  H01L27/15 ,  H01L29/267 ,  H01L29/24

    CPC分类号： H01L33/52 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00

    摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

    摘要翻译： 发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410） ，14,16,212,412）。 透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。 与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。 密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

    Light emitting packages and methods of making same
    6.
    发明授权
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号：US07842960B2

    公开(公告)日：2010-11-30

    申请号：US11516533

    申请日：2006-09-06

    申请人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    发明人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0753 ,  G02F1/353 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/644 ,  H01L2924/0002 ,  H01S5/02288 ,  H01S5/02296 ,  H01L2924/00

    摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

    摘要翻译： 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳（40）中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /（m·K）的值。

    BACKLIGHTING LED POWER DEVICES
    7.
    发明申请
    BACKLIGHTING LED POWER DEVICES 审中-公开
    背光LED电源设备

    公开(公告)号：US20090147513A1

    公开(公告)日：2009-06-11

    申请号：US11950955

    申请日：2007-12-05

    申请人： Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Matthew L. Sommers ,  Mark J. Mayer ,  Christopher L. Bohler

    发明人： Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Matthew L. Sommers ,  Mark J. Mayer ,  Christopher L. Bohler

    IPC分类号： F21V7/00 ,  F21V5/00 ,  F21V9/16

    CPC分类号： G02F1/133603 ,  G02B6/0021 ,  G02B6/0031 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133614

    摘要： A generally planar illumination, display, or backlighting device is disclosed, including a generally planar arrangement of side emitting light emitting diode (LED) devices generating side emitted illumination, and a generally planar arrangement of wavelength conversion elements arranged coplanar with the generally planar arrangement of side emitting light emitting diode (LED) devices. The wavelength conversion elements are interspersed amongst the side emitting LED devices and configured to wavelength convert the side emitted illumination generated by the side emitting LED devices. A display device using such a generally planar illumination device is also disclosed, in which a liquid crystal display (LCD) panel is backlit by the generally planar illumination device.

    摘要翻译： 公开了一种大体上平面的照明，显示器或背光装置，包括产生侧发射照明的侧发射发光二极管（LED）器件的大致平面布置，以及布置为与平面布置共面的波长转换元件 侧发光二极管（LED）装置。 波长转换元件分散在侧面发射LED器件中并且被配置为波长转换由侧向发射LED器件产生的侧发射照明。 还公开了一种使用这种大致平面的照明装置的显示装置，其中液晶显示器（LCD）面板由大体上平面的照明装置背光。

    Light emitting packages and methods of making same
    8.
    发明申请
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号：US20080054280A1

    公开(公告)日：2008-03-06

    申请号：US11516533

    申请日：2006-09-06

    申请人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    发明人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L25/0753 ,  G02F1/353 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/644 ,  H01L2924/0002 ,  H01S5/02288 ,  H01S5/02296 ,  H01L2924/00

    摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).

    摘要翻译： 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 布置在大致保形壳（40）中的导热填料有效地将复合壳材料的热导率提高到高于0.3W /（m.K）的值。