Invention Grant
- Patent Title: Light emitting diode component
- Patent Title (中): 发光二极管组件
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Application No.: US10831862Application Date: 2004-04-26
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Publication No.: US07224000B2Publication Date: 2007-05-29
- Inventor: Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
- Applicant: Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
- Applicant Address: US OH Valley View
- Assignee: Lumination, LLC
- Current Assignee: Lumination, LLC
- Current Assignee Address: US OH Valley View
- Agency: Fay Sharpe LLC
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L29/227 ; H01L27/15 ; H01L29/267 ; H01L29/24
Abstract:
A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
Public/Granted literature
- US20050239227A1 Light emitting diode component Public/Granted day:2005-10-27
Information query
IPC分类:
