Invention Grant
US07233162B2 Arrangements having IC voltage and thermal resistance designated on a per IC basis
有权
具有IC电压和热阻的指令在每个IC基础上的布置
- Patent Title: Arrangements having IC voltage and thermal resistance designated on a per IC basis
- Patent Title (中): 具有IC电压和热阻的指令在每个IC基础上的布置
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Application No.: US11182649Application Date: 2005-07-14
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Publication No.: US07233162B2Publication Date: 2007-06-19
- Inventor: Tawfik Arabi , Hung-Piao Ma , Gregory M. Iovino , Shai Rotem , Avner Kornfeld , Gregory F. Taylor
- Applicant: Tawfik Arabi , Hung-Piao Ma , Gregory M. Iovino , Shai Rotem , Avner Kornfeld , Gregory F. Taylor
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
Systems for testing a plurality of integrated circuits at a plurality of frequencies and voltages is disclosed. In one embodiment, a plurality of integrated circuits is tested at least once within a predetermined set of combinations of frequencies and voltages. If the integrated circuit fails testing within any combination of a frequency and voltage within the predetermined set, the integrated circuit is retested at a different predetermined set of combinations of frequencies and voltages. If the integrated circuit fails testing within any combination of a frequency and voltage within the different predetermined set, the integrated circuit is discarded.
Public/Granted literature
- US20050247605A1 Arrangements having IC voltage and thermal resistance designated on a per IC basis Public/Granted day:2005-11-10
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