Invention Grant
- Patent Title: Connection device and test system
- Patent Title (中): 连接设备和测试系统
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Application No.: US10873168Application Date: 2004-06-23
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Publication No.: US07285430B2Publication Date: 2007-10-23
- Inventor: Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
- Applicant: Susumu Kasukabe , Terutaka Mori , Akihiko Ariga , Hidetaka Shigi , Takayoshi Watanabe , Ryuji Kono
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP09-119107 19970509; JPP10-049912 19980303
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.
Public/Granted literature
- US20040235207A1 Connection device and test system Public/Granted day:2004-11-25
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