公开(公告)号：US20060094162A1

公开(公告)日：2006-05-04

申请号：US11253575

申请日：2005-10-20

Applicant: Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

Inventor： Akira Yabushita ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

IPC: H01L21/50

CPC classification number: G01R1/0735 ,  Y10T29/49156

Abstract: In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

Abstract translation: 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

公开(公告)号：US06305230B1

公开(公告)日：2001-10-23

申请号：US09423385

申请日：1999-11-08

Applicant: Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: G01L100

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: A connection device and test system is capable of stable, low load damage-free probing of devices under test, which have many pins with a narrow pitch. Furthermore in order to achieve high speed exchange of electrical signals or so-called high frequency electrical signals, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multilayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multilayer film. A clamping member is provided on the frame to make the multilayer film project out to eliminate slack in the multilayer film, a contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member, and a compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 一个连接装置和测试系统能够稳定的，低负载的无损探测被测器件，其具有许多具有窄间距的引脚。 此外，为了实现电信号的高速交换或所谓的高频电信号，提供支撑构件以支撑连接装置，多个尖端接触端子排列在探测侧的区域中，多层膜 具有电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹在多层膜的后侧。 夹持构件设置在框架上以使多层膜突出以消除多层膜中的松弛，提供接触压力装置，用于使接触端子的顶端与来自支撑构件的预定接触压力接触每个电极 并且提供顺从机构，使得尖端表面的接触端子组与电极组端子表面平行排列，使得接触端子的尖端以等压接触电极的表面 。

公开(公告)号：US20110014727A1

公开(公告)日：2011-01-20

申请号：US12883982

申请日：2010-09-16

Applicant: Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

Inventor： Akira YABUSHITA ,  Yasunori Narizuka ,  Susumu Kasukabe ,  Terutaka Mori ,  Etsuko Takane ,  Akio Hasebe ,  Kenji Kawakami

IPC: H01L21/66 ,  H05K3/02

CPC classification number: G01R1/0735 ,  Y10T29/49156

Abstract: In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.

Abstract translation: 在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属 在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。 因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

公开(公告)号：US07390732B1

公开(公告)日：2008-06-24

申请号：US09462796

申请日：1998-07-15

Applicant: Takayoshi Watanabe ,  Hidetaka Shigi ,  Susumu Kasukabe ,  Terutaka Mori

Inventor： Takayoshi Watanabe ,  Hidetaka Shigi ,  Susumu Kasukabe ,  Terutaka Mori

IPC: H01L21/44

CPC classification number: H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124 ,  H01L2224/05144

Abstract: A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump electrodes are bonded onto pad electrodes arranged on a semiconductor chip to form the semiconductor device.

Abstract translation: 一种半导体器件，其能够以低成本促进高密度安装，而不会在与基板连接时引起任何不良导通，其安装结构及其制造方法，其特征在于，金字塔形凸起电极接合到布置在 形成半导体器件的半导体芯片。

公开(公告)号：US20080009082A1

公开(公告)日：2008-01-10

申请号：US11853979

申请日：2007-09-12

Applicant: Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: H01L21/66

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US07285430B2

公开(公告)日：2007-10-23

申请号：US10873168

申请日：2004-06-23

Applicant: Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: G01R31/26

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US07219422B2

公开(公告)日：2007-05-22

申请号：US10765917

申请日：2004-01-29

Applicant: Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

Inventor： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC: H05K3/00 ,  H01R9/00

CPC classification number: G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

Abstract: The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

Abstract translation: 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US06197603B1

公开(公告)日：2001-03-06

申请号：US09157153

申请日：1998-09-18

Applicant: Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

Inventor： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC: G01R3126

CPC classification number: G01R3/00 ,  G01R1/0735

Abstract: Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

Abstract translation: 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US20090209053A1

公开(公告)日：2009-08-20

申请号：US12408000

申请日：2009-03-20

Applicant: Susumu KASUKABE ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu KASUKABE ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: H01L21/66

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multilayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multilayer film. A clamping member is provided on the frame to make the multilayer film project out to eliminate slack in the multilayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 为了在连接装置和测试器之间实现电信号的高速交换，提供支撑构件以支撑连接装置，多个尖端接触端子排列在探测侧的区域中，提供多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多层膜的后侧。 在框架上设置夹紧构件以使多层膜突出以消除多层膜中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US07351597B2

公开(公告)日：2008-04-01

申请号：US11750371

申请日：2007-05-18

Applicant: Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

Inventor： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC: H01L21/66

CPC classification number: G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

Abstract: The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

Abstract translation: 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。