公开(公告)号：US06305230B1

公开(公告)日：2001-10-23

申请号：US09423385

申请日：1999-11-08

申请人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

发明人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC分类号： G01L100

CPC分类号： G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

摘要： A connection device and test system is capable of stable, low load damage-free probing of devices under test, which have many pins with a narrow pitch. Furthermore in order to achieve high speed exchange of electrical signals or so-called high frequency electrical signals, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multilayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multilayer film. A clamping member is provided on the frame to make the multilayer film project out to eliminate slack in the multilayer film, a contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member, and a compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

摘要翻译： 一个连接装置和测试系统能够稳定的，低负载的无损探测被测器件，其具有许多具有窄间距的引脚。 此外，为了实现电信号的高速交换或所谓的高频电信号，提供支撑构件以支撑连接装置，多个尖端接触端子排列在探测侧的区域中，多层膜 具有电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹在多层膜的后侧。 夹持构件设置在框架上以使多层膜突出以消除多层膜中的松弛，提供接触压力装置，用于使接触端子的顶端与来自支撑构件的预定接触压力接触每个电极 并且提供顺从机构，使得尖端表面的接触端子组与电极组端子表面平行排列，使得接触端子的尖端以等压接触电极的表面 。

公开(公告)号：US07285430B2

公开(公告)日：2007-10-23

申请号：US10873168

申请日：2004-06-23

申请人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

发明人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC分类号： G01R31/26

CPC分类号： G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

摘要翻译： 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US20080009082A1

公开(公告)日：2008-01-10

申请号：US11853979

申请日：2007-09-12

申请人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

发明人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC分类号： H01L21/66

CPC分类号： G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

摘要翻译： 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US07541202B2

公开(公告)日：2009-06-02

申请号：US11853979

申请日：2007-09-12

申请人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

发明人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

公开(公告)号：US06759258B2

公开(公告)日：2004-07-06

申请号：US09971606

申请日：2001-10-09

申请人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

发明人： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC分类号： G01R3126

CPC分类号： G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

摘要： To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

摘要翻译： 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US06197603B1

公开(公告)日：2001-03-06

申请号：US09157153

申请日：1998-09-18

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

摘要翻译： 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US06455335B1

公开(公告)日：2002-09-24

申请号：US09653624

申请日：2000-08-31

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

公开(公告)号：US07198962B2

公开(公告)日：2007-04-03

申请号：US10411283

申请日：2003-04-11

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R31/26 ,  H01L21/66 ,  H01L21/00 ,  H01L21/48

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

摘要翻译： 即使当大量区域中的多个探针通过将设置在膜中的探针压迫到晶片而将压力负载施加到压力构件的平面的多个位置时，负载的分散也可以保持在容许范围内 在作为半导体器件制造步骤之一的探针测试步骤/老化测试步骤中与晶片相对的一侧。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US06566150B2

公开(公告)日：2003-05-20

申请号：US10171695

申请日：2002-06-17

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

公开(公告)号：US07390732B1

公开(公告)日：2008-06-24

申请号：US09462796

申请日：1998-07-15

申请人： Takayoshi Watanabe ,  Hidetaka Shigi ,  Susumu Kasukabe ,  Terutaka Mori

发明人： Takayoshi Watanabe ,  Hidetaka Shigi ,  Susumu Kasukabe ,  Terutaka Mori

IPC分类号： H01L21/44

CPC分类号： H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124 ,  H01L2224/05144

摘要： A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump electrodes are bonded onto pad electrodes arranged on a semiconductor chip to form the semiconductor device.

摘要翻译： 一种半导体器件，其能够以低成本促进高密度安装，而不会在与基板连接时引起任何不良导通，其安装结构及其制造方法，其特征在于，金字塔形凸起电极接合到布置在 形成半导体器件的半导体芯片。