发明授权
- 专利标题: Semiconductor light-emitting device and method of manufacturing the same
- 专利标题(中): 半导体发光装置及其制造方法
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申请号: US10983927申请日: 2004-11-08
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公开(公告)号: US07332744B2公开(公告)日: 2008-02-19
- 发明人: Tomonori Hino , Hironobu Narui , Takayuki Kawasumi , Tsuyoshi Nagatake , Yuichi Kuromizu , Tadahiko Kawasaki , Noriko Kobayashi , Masaki Shiozaki , Jugo Mitomo , Michiko Komine
- 申请人: Tomonori Hino , Hironobu Narui , Takayuki Kawasumi , Tsuyoshi Nagatake , Yuichi Kuromizu , Tadahiko Kawasaki , Noriko Kobayashi , Masaki Shiozaki , Jugo Mitomo , Michiko Komine
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sonnenschein Nath & Rosenthal LLP
- 优先权: JPP2003-379496 20031110
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01S5/00
摘要:
A semiconductor light-emitting device capable of improving device characteristics such as life and reliability is provided. A current confinement layer includes a non-oxidized region made of AlAs or the like corresponding to a current injection region in an active layer, and an oxidized region made of aluminum oxide corresponding to a non-current injection region. The oxidized region is formed by forming a non-oxidized layer made of AlAs or the like and then oxidizing part of the non-oxidized layer at a temperature from 240° C. to less than 375° C. The thickness of the oxidized region is preferably from 10 nm to 1000 nm. The width of the one side of the oxidized region is one time or more of the width of the non-oxidized region or seven times or less thereof The distance between current confinement layer and the active layer is preferably 50 nm or more, or 500 nm or less, and more preferably 180 nm or more.
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