Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing
    1.
    发明授权
    Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing 有权
    半导体发光元件,其制造方法,背衬上形成的凸部和用于背衬的凸部形成方法

    公开(公告)号:US08409893B2

    公开(公告)日:2013-04-02

    申请号:US13356202

    申请日:2012-01-23

    IPC分类号: H01L21/00

    摘要: A convex part formation method of forming a convex part in parallel with a direction of a backing on the backing having a {100} face as the top surface thereof, includes: (a) forming a mask layer in parallel with the direction on the backing; (b) etch the backing so as to form a convex-part upper layer whose sectional shape on a cutting plane corresponding to a {110} face is an isosceles trapezoid, the base of which is longer than the upper side thereof, and the side surface of which has an inclination of θU; and (c) further etching the backing so as to form a convex-part lower layer whose sectional shape on the cutting plane corresponding to the {110} face is an isosceles trapezoid, the base of which is longer than the upper side thereof, and the side surface of which has an inclination of θD (where θD≠θU).

    摘要翻译: 在具有{100}面作为其顶面的背衬上形成与背衬的<110>方向平行的凸部的凸部形成方法包括:(a) 110>方向在背面; (b)蚀刻背衬以便形成凸起部分上层,其在与{110}面相对应的切割平面上的截面形状是等腰梯形,其基部比其上侧长,并且侧面 其表面具有倾斜度; U; (c)进一步蚀刻背衬,以便形成凸起部分的下层,其在与{110}面对应的切割平面上的截面形状是等腰梯形,其基部比其上侧长;以及 其侧表面具有倾斜度; D(其中&amp; D;≠&thetas; U)。

    Steam oxidation apparatus
    4.
    发明授权
    Steam oxidation apparatus 失效
    蒸汽氧化装置

    公开(公告)号:US07438872B2

    公开(公告)日:2008-10-21

    申请号:US10507666

    申请日:2003-12-26

    IPC分类号: B01J19/00 C23C16/00

    摘要: A steam oxidation apparatus is provided which is capable of ensuring a desirable controllability and reproducibility of the steam oxidation of an object-to-be-oxidized housed in the reactor, by suppressing condensation of the steam in the steam-accompanied inert gas supplied to the reactor.The steam oxidation apparatus 78 is an apparatus used for forming the current confinement structure into the surface-emitting laser element by subjecting the high-Al-content layer to steam oxidation, and is equipped with a reactor 42 for the steam oxidation, a steam-accompanied inert gas system for supplying a steam-accompanied inert gas to the reactor 42, an inert gas system for supplying an inert gas to the reactor 42, a reactor bypass pipe 52 for allowing the steam-accompanied inert gas system and inert gas system to bypass the reactor, and an exhaust system for discharging exhaust gas from the reactor 42. The steam oxidation apparatus 78 is further equipped with a thermostatic oven 72 which houses the H2O bubbler 60, second gas pipe 68, automatic open/close valves 66A to 66D, a portion of the third gas pipe 70 in the vicinity of the automatic open/close valves 66A to 66D, and a portion of the gas inlet port 42A side of the reactor 42.

    摘要翻译: 提供一种蒸汽氧化装置,其能够通过抑制供给到反应器的蒸汽伴随的惰性气体中的蒸汽的冷凝来确保反应器中容纳的被氧化物体的蒸汽氧化的期望的可控性和再现性 反应堆。 蒸汽氧化装置78是用于通过使高Al含量层进行蒸汽氧化将电流限制结构形成到表面发射激光元件中的装置,并且配备有用于蒸汽氧化的反应器42, 用于向反应器42供应伴随蒸汽的惰性气体的惰性气体系统,用于向反应器42供应惰性气体的惰性气体系统,用于允许伴随蒸汽的惰性气体系统和惰性气体系统的反应器旁通管52 绕过反应器,以及用于从反应器42排出废气的排气系统。 蒸汽氧化装置78还配备有恒温炉72,其容纳H 2 O 2起泡器60,第二气体管68,自动打开/关闭阀66A至66D,第三部分 自动打开/关闭阀66A至66D附近的气体管70和反应器42的气体入口42A侧的一部分。

    Steam oxidation method
    7.
    发明授权
    Steam oxidation method 失效
    蒸汽氧化法

    公开(公告)号:US07001851B2

    公开(公告)日:2006-02-21

    申请号:US10871900

    申请日:2004-06-18

    IPC分类号: H01I21/31 H01L21/469

    摘要: This invention provides a steam oxidation method of a matter to be oxidized with proper controllability and reproducibility. It is provided a steam oxidation method, where a semiconductor substrate (a matter to be oxidized) is housed in a steam oxidation reactor and is subjected to: a first step of supplying N2 gas to the reactor housing the semiconductor substrate and substituting the inside of the reactor with N2 gas; a second step of stopping supply of the N2 gas and supplying a steam-accompanied N2 gas, in which the N2 gas is accompanied with steam, to the reactor; a third step of increasing a temperature of the semiconductor substrate to 450° C. (a steam oxidation temperature) while supplying the steam-accompanied N2 gas; and a fourth step of holding the semiconductor substrate for a predetermined time at 450° C.

    摘要翻译: 本发明提供了一种具有适当可控性和再现性的待氧化物质的蒸汽氧化方法。 提供一种蒸汽氧化法,其中将半导体衬底(待氧化的物质)容纳在蒸汽氧化反应器中,并经受:向反应器壳体供应N 2气体的第一步骤 半导体衬底并用N 2气体代替反应器内部; 第二步骤是停止供应N 2气体并供应伴随着N 2气体的蒸气伴随的N 2气体,其中伴随着N 2气体 用蒸汽,到反应器; 在提供伴随蒸汽的N 2气体的同时,将半导体衬底的温度升高至450℃(蒸汽氧化温度)的第三步骤; 以及在450℃下将半导体衬底保持预定时间的第四步骤。

    Thin film-forming apparatus
    9.
    发明授权
    Thin film-forming apparatus 失效
    薄膜成膜装置

    公开(公告)号:US06960262B2

    公开(公告)日:2005-11-01

    申请号:US10486801

    申请日:2003-06-17

    CPC分类号: C23C14/228 C23C14/12

    摘要: A thin film formation apparatus by which source gas is supplied uniformly to the surface of a substrate so that an organic thin film of a uniform film thickness can be formed on the surface of the substrate. The thin film formation apparatus includes a vacuum chamber (11), a substrate holder (12) provided in the vacuum chamber (11), and a gas supplying end element (22) for supplying gas toward a substrate mounting face (12a) of the substrate holder (12). The gas supplying end element (22) is formed so as to supply the source gas in an elongated rectangular shape to the substrate mounting face (12a).

    摘要翻译: 将源气体均匀地供给到基板的表面的薄膜形成装置,能够在基板的表面上形成均匀膜厚的有机薄膜。 薄膜形成装置包括真空室(11),设置在真空室(11)中的基板保持件(12)和用于向基板安装面(12a)供给气体的气体供给端部元件(22) 衬底保持器(12)。 气体供给端元件(22)形成为将细长的矩形形状的源气体供给到基板安装面(12a)。