发明授权
US07431966B2 Atomic layer deposition method of depositing an oxide on a substrate
有权
在衬底上沉积氧化物的原子层沉积方法
- 专利标题: Atomic layer deposition method of depositing an oxide on a substrate
- 专利标题(中): 在衬底上沉积氧化物的原子层沉积方法
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申请号: US10733201申请日: 2003-12-09
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公开(公告)号: US07431966B2公开(公告)日: 2008-10-07
- 发明人: Garo J. Derderian , Shuang Meng , Danny Dynka
- 申请人: Garo J. Derderian , Shuang Meng , Danny Dynka
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: C23C16/00
- IPC分类号: C23C16/00 ; B05D3/06 ; B05D5/12 ; C23C16/06 ; C23C16/40
摘要:
The invention includes atomic layer deposition methods of depositing an oxide on a substrate. In one implementation, a substrate is positioned within a deposition chamber. A first species is chemisorbed onto the substrate to form a first species monolayer within the deposition chamber from a gaseous precursor. The chemisorbed first species is contacted with remote plasma oxygen derived at least in part from at least one of O2 and O3 and with remote plasma nitrogen effective to react with the first species to form a monolayer comprising an oxide of a component of the first species monolayer. The chemisorbing and the contacting with remote plasma oxygen and with remote plasma nitrogen are successively repeated effective to form porous oxide on the substrate. Other aspects and implementations are contemplated.
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