发明授权
- 专利标题: Chemical processing system and method
- 专利标题(中): 化学处理系统和方法
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申请号: US11233077申请日: 2005-09-23
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公开(公告)号: US07462243B2公开(公告)日: 2008-12-09
- 发明人: Arthur H Laflamme, Jr. , Jay Wallace , Eric Strang
- 申请人: Arthur H Laflamme, Jr. , Jay Wallace , Eric Strang
- 申请人地址: JP
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; C23C16/00 ; C23C14/00
摘要:
A chemical processing system includes a processing chamber containing a chemical processing region and a gas injection system. The gas injection system includes at least one first gas injection orifice and at least one second gas injection orifice in communication with the chemical processing region to expose a substrate to mixed first and second process gases. Other embodiments of the chemical processing system can include a sensor to sense a mixing rate of the process gases or a shroud defining a portion of the at least one first gas injection orifice to control mixing of the process gases. A method of mixing process gas in a chemical processing region of a chemical processing system is provided in which a first process gas and a second process gas are injected into the chemical processing region and mixed. A mixture rate is sensed and used to control the mixing.
公开/授权文献
- US20060090850A1 Chemical processing system and method 公开/授权日:2006-05-04
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