发明授权
- 专利标题： Semiconductor light-emitting device
- 专利标题（中）： 半导体发光装置
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申请号： US11329589申请日： 2006-01-10
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公开(公告)号： US07468528B2公开(公告)日： 2008-12-23
- 发明人: Jun Suzuki , Masato Doi , Hiroyuki Okuyama , Goshi Biwa
- 申请人： Jun Suzuki , Masato Doi , Hiroyuki Okuyama , Goshi Biwa
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Bell, Boyd & Lloyd
- 优先权： JP2005-006704 20050113
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A semiconductor light-emitting device is provided. The semiconductor light-emitting device includes a laminated semiconductor structure portion composed of at least a first conductivity type first cladding layer, an active layer and a second conductivity type second cladding layer, wherein an outer peripheral surface of this laminated semiconductor structure portion is formed as a curved surface shape which is protrusively curved or bent with respect to the outside of the laminated direction.
公开/授权文献
- US20060169997A1 Semiconductor light-emitting device 公开/授权日：2006-08-03
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