发明授权
- 专利标题: Semiconductor memory device
- 专利标题(中): 半导体存储器件
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申请号: US11889704申请日: 2007-08-15
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公开(公告)号: US07675122B2公开(公告)日: 2010-03-09
- 发明人: Yuuichi Hirano , Takashi Ipposhi , Shigeto Maegawa , Koji Nii
- 申请人: Yuuichi Hirano , Takashi Ipposhi , Shigeto Maegawa , Koji Nii
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2003-304444 20030828; JP2004-193462 20040630
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/94
摘要:
A contact connected to a word line is formed on a gate electrode of an access transistor of an SRAM cell. The contact passes through an element isolation insulating film to reach an SOI layer. A body region of a driver transistor and that of the access transistor are electrically connected with each other through the SOI layer located under the element isolation insulating film. Therefore, the access transistor is in a DTMOS structure having the gate electrode connected with the body region through the contact, which in turn is also electrically connected to the body region of the driver transistor. Thus, operations can be stabilized while suppressing increase of an area for forming the SRAM cell.
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