发明授权
- 专利标题: Tri-layered power scheme for architectures which contain a micro-controller
- 专利标题(中): 包含微控制器的架构的三层电源方案
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申请号: US11963215申请日: 2007-12-21
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公开(公告)号: US07900072B2公开(公告)日: 2011-03-01
- 发明人: Michael Berger , Michael Derr , Joshua Resch , Mukesh Kataria , Mazen Gedeon , Eli Kupermann , Jeffrey John Vick
- 申请人: Michael Berger , Michael Derr , Joshua Resch , Mukesh Kataria , Mazen Gedeon , Eli Kupermann , Jeffrey John Vick
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Kacvinsky Daisak, PLLC
- 主分类号: G06F1/00
- IPC分类号: G06F1/00 ; G06F1/26 ; H04M1/00 ; G11C5/14
摘要:
Various embodiments are directed to a tri-layered power scheme for architectures which contain a microcontroller. In one embodiment, a power management system may comprise a microcontroller in a chipset, a low consumption power well to control a power supply to the microcontroller, and a power controller to control a power supply to the low consumption power well. The power management system may be arranged to switch among multiple power consumption states. In a maximum power consumption state, the microcontroller is on, the power controller is on, and the low consumption power well is on. In an intermediate power consumption state, the microcontroller is off, the power controller is on, and the low consumption power well is required to be on. In a minimum power consumption state, the microcontroller is off, the power controller is on, and the low consumption power well is optionally on or off at the discretion of the power controller. Other embodiments are described and claimed.