发明授权
- 专利标题: Closed-loop control for effective pad conditioning
- 专利标题(中): 闭环控制有效的垫调节
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申请号: US12489132申请日: 2009-06-22
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公开(公告)号: US08337279B2公开(公告)日: 2012-12-25
- 发明人: Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
- 申请人: Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson & Sheridan, LLP
- 主分类号: B24B1/00
- IPC分类号: B24B1/00 ; B24B49/00 ; B24B51/00
摘要:
A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.
公开/授权文献
- US20090318060A1 CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING 公开/授权日:2009-12-24
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