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公开(公告)号：US20110256812A1
公开(公告)日：2011-10-20
申请号：US13087180
申请日：2011-04-14
申请人： Sivakumar Dhandapani , Jun Qian , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson , Gregory E. Menk , Stan D. Tsai
发明人： Sivakumar Dhandapani , Jun Qian , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson , Gregory E. Menk , Stan D. Tsai
IPC分类号： B24B53/02
CPC分类号： B24B53/017 , B24B37/042
摘要： Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.
摘要翻译： 本文描述的实施例使用调节扫描的闭环控制（CLC），以在整个衬垫寿命期间跨越焊盘实现均匀的凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，从而校正焊盘轮廓上随焊盘和磁盘寿命可能出现的漂移。 焊盘轮廓CLC可以通过持续的调节来均匀地减小槽深度，提供更长的消耗品寿命和降低的操作成本。
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公开(公告)号：US20090318060A1
公开(公告)日：2009-12-24
申请号：US12489132
申请日：2009-06-22
申请人： Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
发明人： Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
CPC分类号： B24B49/18 , B24B37/005 , B24B37/042
摘要： A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.
摘要翻译： 提供了一种用于调理抛光垫的方法和装置。 调节元件由可旋转地安装到枢轴点处的基座的调节臂保持。 执行器绕枢轴点枢转臂。 调理元件被推靠在抛光垫的表面上，并相对于抛光垫平移以从抛光垫移除材料并使其表面变粗糙。 研磨调理表面与抛光垫表面的相互作用产生摩擦力。 可以通过监视施加到枢转点的扭矩来监测摩擦力，并且由此控制材料移除。 调节垫的调节时间，下压力，平移速率或旋转可以基于测量的扭矩来调节。
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公开(公告)号：US09138860B2
公开(公告)日：2015-09-22
申请号：US13087180
申请日：2011-04-14
申请人： Sivakumar Dhandapani , Jun Qian , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson , Gregory E. Menk , Stan D. Tsai
发明人： Sivakumar Dhandapani , Jun Qian , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson , Gregory E. Menk , Stan D. Tsai
IPC分类号： B24B53/02 , B24B53/017 , B24B37/04
CPC分类号： B24B53/017 , B24B37/042
摘要： Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.
摘要翻译： 本文描述的实施例使用调节扫描的闭环控制（CLC），以在整个衬垫寿命期间跨越焊盘实现均匀的凹槽深度去除。 集成到调节臂中的传感器使得可以在现场和实时监测焊盘堆叠厚度。 来自厚度传感器的反馈用于修改焊盘表面上的焊盘调节器停留时间，从而校正焊盘轮廓上随焊盘和磁盘寿命可能出现的漂移。 焊盘轮廓CLC可以通过持续的调节来均匀地减小槽深度，提供更长的消耗品寿命和降低的操作成本。
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公开(公告)号：US20130122783A1
公开(公告)日：2013-05-16
申请号：US13129351
申请日：2011-04-13
申请人： Gregory E. Menk , Stan D. Tsai , Sang J. Cho , Slvakumar Dhandapani , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson
发明人： Gregory E. Menk , Stan D. Tsai , Sang J. Cho , Slvakumar Dhandapani , Christopher D. Cocca , Jason G. Fung , Shou-Sung Chang , Charles C. Garretson
IPC分类号： B24B53/017
CPC分类号： B24B53/017 , B24B37/042
摘要： A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.
摘要翻译： 提供了一种用于调节CMP系统中的抛光垫的方法和装置。 在一个实施例中，一种用于调节抛光垫的方法包括向调节盘施加向下的力，该调节盘将调节盘推向抛光垫，测量扫过经过抛光垫的调节盘所需的扭矩，确定向下力的变化 通过将测量的扭矩与模型力分布（MFP）进行比较，并且响应于确定的变化来调节调节盘对抛光垫施加的向下的力。
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公开(公告)号：US08337279B2
公开(公告)日：2012-12-25
申请号：US12489132
申请日：2009-06-22
申请人： Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
发明人： Sivakumar Dhandapani , Stan D. Tsai , Daxin Mao , Sameer Deshpande , Shou-Sung Chang , Gregory E. Menk , Charles C. Garretson , Jason Garcheung Fung , Christopher D. Cocca , Hung Chih Chen
CPC分类号： B24B49/18 , B24B37/005 , B24B37/042
摘要： A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.
摘要翻译： 提供了一种用于调理抛光垫的方法和装置。 调节元件由可旋转地安装到枢轴点处的基座的调节臂保持。 执行器绕枢轴点枢转臂。 调理元件被推靠在抛光垫的表面上，并相对于抛光垫平移以从抛光垫移除材料并使其表面变粗糙。 研磨调理表面与抛光垫表面的相互作用产生摩擦力。 可以通过监视施加到枢转点的扭矩来监测摩擦力，并且由此控制材料移除。 调节垫的调节时间，下压力，平移速率或旋转可以基于测量的扭矩来调节。
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