Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US12839333Application Date: 2010-07-19
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Publication No.: US08489902B2Publication Date: 2013-07-16
- Inventor: Jae Bum Ko , Sang Jin Byeon
- Applicant: Jae Bum Ko , Sang Jin Byeon
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2010-0017743 20100226
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/12 ; H03K19/096 ; H03L7/00 ; H03H11/16 ; H03H11/26 ; G11C5/02 ; G11C5/06 ; G01R13/00 ; G01R25/00
Abstract:
A semiconductor integrated circuit includes: a plurality of chips configured to receive an external voltage. Each one of the chips detects a signal delay characteristic of the one of the chips to generate an internal voltage having a level corresponding to the signal delay characteristic.
Public/Granted literature
- US20110210780A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2011-09-01
Information query
