发明授权
US08598663B2 Semiconductor structure having NFET and PFET formed in SOI substrate with underlapped extensions
失效
具有NFET和PFET的半导体结构形成在具有延伸延伸的SOI衬底中
- 专利标题: Semiconductor structure having NFET and PFET formed in SOI substrate with underlapped extensions
- 专利标题(中): 具有NFET和PFET的半导体结构形成在具有延伸延伸的SOI衬底中
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申请号: US13108290申请日: 2011-05-16
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公开(公告)号: US08598663B2公开(公告)日: 2013-12-03
- 发明人: Kangguo Cheng , Bruce B. Doris , Balasubramanian S. Haran , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
- 申请人: Kangguo Cheng , Bruce B. Doris , Balasubramanian S. Haran , Ali Khakifirooz , Pranita Kulkarni , Ghavam G. Shahidi
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Law Offices of Ira D. Blecker, P.C.
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/02 ; H01L29/786 ; H01L21/70
摘要:
A semiconductor structure which includes a semiconductor on insulator (SOI) substrate. The SOI substrate includes a base semiconductor layer; a buried oxide (BOX) layer in contact with the base semiconductor layer; and an SOI layer in contact with the BOX layer. The semiconductor structure further includes a circuit formed with respect to the SOI layer, the circuit including an N type field effect transistor (NFET) having source and drain extensions in the SOI layer and a gate; and a P type field effect transistor (PFET) having source and drain extensions in the SOI layer and a gate. There may also be a well under each of the NFET and PFET. There is a nonzero electrical bias being applied to the SOI substrate. One of the NFET extensions and PFET extensions may be underlapped with respect to the NFET gate or PFET gate, respectively.
公开/授权文献
- US20120292705A1 SEMICONDUCTOR STRUCTURE HAVING UNDERLAPPED DEVICES 公开/授权日:2012-11-22
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