发明授权
- 专利标题： Debond interconnect structures
- 专利标题（中）： Debond互连结构
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申请号： US12756748申请日： 2010-04-08
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公开(公告)号： US08637778B2公开(公告)日： 2014-01-28
- 发明人: Qing Ma , Jun He , Patrick Morrow , Paul B. Fischer , Sridhar Balakrishnan , Satish Radhakrishnan , Tatyana Tanya Andryushchenko , Guanghai Xu
- 申请人： Qing Ma , Jun He , Patrick Morrow , Paul B. Fischer , Sridhar Balakrishnan , Satish Radhakrishnan , Tatyana Tanya Andryushchenko , Guanghai Xu
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K7/02
摘要：
The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
公开/授权文献
- US20110247872A1 DEBOND INTERCONNECT STRUCTURES 公开/授权日：2011-10-13
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