公开(公告)号：US08637778B2

公开(公告)日：2014-01-28

申请号：US12756748

申请日：2010-04-08

申请人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

发明人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

IPC分类号： H05K1/03 ,  H05K7/02

CPC分类号： H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

摘要： The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

摘要翻译： 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US20110247872A1

公开(公告)日：2011-10-13

申请号：US12756748

申请日：2010-04-08

申请人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

发明人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushchenko ,  Guanghai Xu

IPC分类号： H05K1/11 ,  B23K1/00 ,  H05K1/09

CPC分类号： H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

摘要： The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

摘要翻译： 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US20140106560A1

公开(公告)日：2014-04-17

申请号：US14132157

申请日：2013-12-18

申请人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushcheko ,  Guanghai Xu

发明人： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Tanya Andryushcheko ,  Guanghai Xu

IPC分类号： H01L23/00

CPC分类号： H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

摘要： The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

摘要翻译： 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。