发明授权
- 专利标题： Semiconductor package structure and method for making the same
- 专利标题（中）： 半导体封装结构及其制造方法
-
申请号： US13525460申请日： 2012-06-18
-
公开(公告)号： US08658466B2公开(公告)日： 2014-02-25
- 发明人: Chin-Tang Hsieh , Chih-Ming Kuo , Chia-Jung Tu , Shih-Chieh Chang , Chih-Hsien Ni , Lung-Hua Ho , Chaun-Yu Wu , Kung-An Lin
- 申请人： Chin-Tang Hsieh , Chih-Ming Kuo , Chia-Jung Tu , Shih-Chieh Chang , Chih-Hsien Ni , Lung-Hua Ho , Chaun-Yu Wu , Kung-An Lin
- 申请人地址： TW Hsinchu
- 专利权人： Chipbond Technology Corporation
- 当前专利权人： Chipbond Technology Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jackson IPG PLLC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.