公开(公告)号：US20130334681A1

公开(公告)日：2013-12-19

申请号：US13525460

申请日：2012-06-18

申请人： Chin-Tang Hsieh ,  Chih-Ming Kuo ,  Chia-Jung Tu ,  Shih-Chieh Chang ,  Chih-Hsien Ni ,  Lung-Hua Ho ,  Chaun-Yu Wu ,  Kung-An Lin

发明人： Chin-Tang Hsieh ,  Chih-Ming Kuo ,  Chia-Jung Tu ,  Shih-Chieh Chang ,  Chih-Hsien Ni ,  Lung-Hua Ho ,  Chaun-Yu Wu ,  Kung-An Lin

IPC分类号： H01L23/488 ,  H01L21/56

CPC分类号： H01L23/49811 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11831 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13011 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16058 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.

摘要翻译： 半导体封装结构包括第一衬底，第二衬底和密封剂。 第一基板包括多个第一凸块和多个第一焊料层。 每个第一焊料层形成在每个第一凸块上，并且包括具有内表面的锥形槽。 第二基板包括多个第二凸块和多个第二焊料层。 每个第二焊料层形成在每个第二凸块上并且包括外表面。 每个第二焊料层是锥形体。 第二焊料层耦合到第一焊料层并且容纳在第一焊料层内。 锥形槽的内表面与第二焊料层的外表面接触。 密封剂形成在第一基板和第二基板之间。

公开(公告)号：US08658466B2

公开(公告)日：2014-02-25

申请号：US13525460

申请日：2012-06-18

申请人： Chin-Tang Hsieh ,  Chih-Ming Kuo ,  Chia-Jung Tu ,  Shih-Chieh Chang ,  Chih-Hsien Ni ,  Lung-Hua Ho ,  Chaun-Yu Wu ,  Kung-An Lin

发明人： Chin-Tang Hsieh ,  Chih-Ming Kuo ,  Chia-Jung Tu ,  Shih-Chieh Chang ,  Chih-Hsien Ni ,  Lung-Hua Ho ,  Chaun-Yu Wu ,  Kung-An Lin

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11831 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13011 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16058 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.

摘要翻译： 半导体封装结构包括第一衬底，第二衬底和密封剂。 第一基板包括多个第一凸块和多个第一焊料层。 每个第一焊料层形成在每个第一凸块上，并且包括具有内表面的锥形槽。 第二基板包括多个第二凸块和多个第二焊料层。 每个第二焊料层形成在每个第二凸块上并且包括外表面。 每个第二焊料层是锥形体。 第二焊料层耦合到第一焊料层并且容纳在第一焊料层内。 锥形槽的内表面与第二焊料层的外表面接触。 密封剂形成在第一基板和第二基板之间。