Invention Grant
- Patent Title: Method of fabricating a lithography mask
- Patent Title (中): 光刻掩模的制造方法
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Application No.: US13564334Application Date: 2012-08-01
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Publication No.: US08679707B2Publication Date: 2014-03-25
- Inventor: Hsin-Chang Lee , Yun-Yue Lin , Pei-Cheng Hsu , Chia-Jen Chen , Ta-Cheng Lien , Anthony Yen
- Applicant: Hsin-Chang Lee , Yun-Yue Lin , Pei-Cheng Hsu , Chia-Jen Chen , Ta-Cheng Lien , Anthony Yen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/22

Abstract:
A method of fabricating an extreme ultraviolet (EUV) mask is disclosed. The method includes providing a substrate, forming a reflective multilayer (ML) over the substrate, forming a buffer layer over the reflective ML, forming an absorption layer over the buffer layer and forming a capping layer over the absorption layer. The capping layer and the absorption layer are etched to form the EUV mask.
Public/Granted literature
- US20140038088A1 Method of Fabricating a Lithography Mask Public/Granted day:2014-02-06
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