Invention Grant
US08804106B2 System and method for nondestructively measuring concentration and thickness of doped semiconductor layers
有权
用于非破坏性地测量掺杂半导体层的浓度和厚度的系统和方法
- Patent Title: System and method for nondestructively measuring concentration and thickness of doped semiconductor layers
- Patent Title (中): 用于非破坏性地测量掺杂半导体层的浓度和厚度的系统和方法
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Application No.: US13530774Application Date: 2012-06-22
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Publication No.: US08804106B2Publication Date: 2014-08-12
- Inventor: NanChang Zhu , Derrick Shaughnessy , Houssam Chouaib , Yaolei Zheng , Lu Yu , Jianli Cui , Jin An , Jianou Shi
- Applicant: NanChang Zhu , Derrick Shaughnessy , Houssam Chouaib , Yaolei Zheng , Lu Yu , Jianli Cui , Jin An , Jianou Shi
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01B11/28

Abstract:
The disclosure is directed to nondestructive systems and methods for simultaneously measuring active carrier concentration and thickness of one or more doped semiconductor layers. Reflectance signals may be defined as functions of active carrier concentration and thickness varying over different wavelengths and over different incidence angles of analyzing illumination reflected off the surface of an analyzed sample. Systems and methods are provided for collecting a plurality of reflectance signals having either different wavelengths or different incidence angle ranges to extract active carrier density and thickness of one or more doped semiconductor layers.
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