Invention Grant
- Patent Title: Semiconductor structure and method for slimming spacer
- Patent Title (中): 半导体结构及减肥垫片的方法
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Application No.: US13928366Application Date: 2013-06-26
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Publication No.: US08841193B2Publication Date: 2014-09-23
- Inventor: Ted Ming-Lang Guo , Chin-Cheng Chien , Shu-Yen Chan , Ling-Chun Chou , Tsung-Hung Chang , Chun-Yuan Wu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor structure including a substrate and a gate structure disposed on the substrate is disclosed. The gate structure includes a gate dielectric layer disposed on the substrate, a gate material layer disposed on the gate dielectric layer and an outer spacer with a rectangular cross section. The top surface of the outer spacer is lower than the top surface of the gate material layer.
Public/Granted literature
- US20130288446A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR SLIMMING SPACER Public/Granted day:2013-10-31
Information query
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