Invention Grant
- Patent Title: Transferring heat through an optical layer of integrated circuitry
- Patent Title (中): 通过集成电路的光学层传输热量
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Application No.: US14093248Application Date: 2013-11-29
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Publication No.: US09058461B2Publication Date: 2015-06-16
- Inventor: Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Paul S. Drake
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G06F17/50 ; G02B6/42 ; G02B6/43
Abstract:
A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.
Public/Granted literature
- US20140095121A1 TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY Public/Granted day:2014-04-03
Information query
