Invention Grant
- Patent Title: Resin composition, and wire and cable using the same
- Patent Title (中): 树脂组成,使用电线电缆
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Application No.: US13474692Application Date: 2012-05-17
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Publication No.: US09127110B2Publication Date: 2015-09-08
- Inventor: Keisuke Sugita , Ryutaro Kikuchi
- Applicant: Keisuke Sugita , Ryutaro Kikuchi
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-113549 20110520
- Main IPC: C08F255/02
- IPC: C08F255/02 ; C08C19/25 ; C08F255/08 ; C08J3/24 ; C08K5/5415 ; C08C19/28 ; C09D123/08 ; C08L51/06 ; H01B3/44 ; C08K5/5425

Abstract:
A resin composition includes a silane-crosslinked polyethylene as a main component provided by crosslinking a polyethylene in the presence of a silanol condensation catalyst and water, the polyethylene being graft-copolymerized with a silane compound by a free radical generating agent. The polyethylene has a density of 0.87 to 0.91 g/cm3. The silane compound is included not less than 2 parts by mass relative to 100 parts by mass of the polyethylene. The resin composition includes silicon detected by a fluorescence X-ray at a rate of not less than 0.3 mass % and has a gel fraction of not less than 70%. A mass ratio of the silane compound to the free radical generating agent is not less than 35 and not more than 150.
Public/Granted literature
- US20120292077A1 RESIN COMPOSITION, AND WIRE AND CABLE USING THE SAME Public/Granted day:2012-11-22
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