Copper wire and dielectric with air gaps

Invention Grant

US09159671B2 Copper wire and dielectric with air gaps 有权

Title translation: 铜线和电介质带气隙

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Patent Title: Copper wire and dielectric with air gaps
Patent Title (中): 铜线和电介质带气隙
Application No.: US14083929

Application Date: 2013-11-19
Publication No.: US09159671B2

Publication Date: 2015-10-13
Inventor: Fen Chen , Jeffrey P. Gambino , Zhong-Xiang He , Trevor A. Thompson , Eric J. White
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Roberts Mlotkowski Safran & Cole, P.C.
Agent David Cain
Main IPC: H01L21/4763
IPC: H01L21/4763 ; H01L23/498 ; H01L21/445 ; H01L21/768 ; H01L23/532 ; H01L23/522 ; H01L23/528

Copper wire and dielectric with air gaps

Abstract:

Approaches for fabricating copper wires in integrated circuits are provided. A method of manufacturing a semiconductor structure includes forming a wire opening in a mask. The method also includes electroplating a conductive material in the wire opening. The method additionally includes forming a cap layer on the conductive material. The method further includes removing the mask. The method still further includes forming spacers on sides of the conductive material. The method additionally includes forming a dielectric film on surfaces of the cap layer and the sidewall spacers.

Abstract(Chinese):

提供了在集成电路中制造铜线的方法。制造半导体结构的方法包括在掩模中形成线开口。该方法还包括在导线开口中电镀导电材料。该方法还包括在导电材料上形成盖层。该方法还包括去除掩模。该方法还包括在导电材料的侧面上形成间隔物。该方法还包括在盖层和侧壁间隔物的表面上形成电介质膜。

Public/Granted literature

US20150137374A1 COPPER WIRE AND DIELECTRIC WITH AIR GAPS Public/Granted day:2015-05-21

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）