Invention Grant
- Patent Title: Multi-spot defect inspection system
- Patent Title (中): 多点缺陷检测系统
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Application No.: US13834662Application Date: 2013-03-15
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Publication No.: US09182358B2Publication Date: 2015-11-10
- Inventor: Zhiwei Xu , Christian Wolters , Juergen Reich , Bret Whiteside , Guoheng Zhao , Jijen Vazhaeparambil , Stephen Biellak , Sam Shamouilian , Mehdi Vaez-Iravani
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G01N21/956

Abstract:
The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.
Public/Granted literature
- US20140268118A1 Multi-Spot Defect Inspection System Public/Granted day:2014-09-18
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