Invention Grant
- Patent Title: Low-defect semiconductor device and method of manufacturing the same
- Patent Title (中): 低缺陷半导体器件及其制造方法
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Application No.: US14294823Application Date: 2014-06-03
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Publication No.: US09190270B2Publication Date: 2015-11-17
- Inventor: Young-jo Tak , Jae-kyun Kim , Joo-sung Kim , Jun-youn Kim , Young-soo Park , Eun-ha Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0064336 20130604; KR10-2014-0067519 20140603
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L33/00 ; H01L33/12 ; H01L33/32 ; H01S5/00 ; H01S5/02 ; H01S5/343

Abstract:
Provided are a low-defect semiconductor device and a method of manufacturing the same. The method includes forming a buffer layer on a silicon substrate, forming an interface control layer on the buffer layer under a first growth condition, and forming a nitride stack on the interface control layer under a second growth condition different from the first growth condition.
Public/Granted literature
- US20140353677A1 LOW-DEFECT SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-12-04
Information query
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