Invention Grant
- Patent Title: Manufacturing method for multi-layer circuit board
- Patent Title (中): 多层电路板的制造方法
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Application No.: US14073869Application Date: 2013-11-07
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Publication No.: US09198303B2Publication Date: 2015-11-24
- Inventor: Pei-Chang Huang , Cheng-Po Yu , Han-Pei Huang , Ai-Hwa Lim
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H05K3/40 ; H05K3/46 ; H05K1/02 ; B05D7/00 ; C23C18/16 ; H05K1/11 ; H05K3/24 ; H05K3/12

Abstract:
A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
Public/Granted literature
- US20150121693A1 MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD Public/Granted day:2015-05-07
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