公开(公告)号：US20150121693A1

公开(公告)日：2015-05-07

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US09198303B2

公开(公告)日：2015-11-24

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: B05D5/12 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  B05D7/00 ,  C23C18/16 ,  H05K1/11 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。