Invention Grant
- Patent Title: Liquid processing method
- Patent Title (中): 液体加工方法
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Application No.: US14580787Application Date: 2014-12-23
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Publication No.: US09224624B2Publication Date: 2015-12-29
- Inventor: Takao Inada , Naoyuki Okamura , Hidetsugu Yano , Yosuke Hachiya
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2010-113186 20100517; JP2011-065807 20110324
- Main IPC: B08B7/00
- IPC: B08B7/00 ; B08B3/00 ; B08B7/04 ; H01L21/67

Abstract:
A liquid processing method is provided for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution. In the intermediate process, an intermediate processing solution having a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution is supplied only to a rear surface of the substrate.
Public/Granted literature
- US20150107631A1 LIQUID PROCESSING METHOD Public/Granted day:2015-04-23
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