Invention Grant
US09234275B2 Method and apparatus of forming metal compound film, and electronic product
有权
形成金属化合物膜和电子产品的方法和装置
- Patent Title: Method and apparatus of forming metal compound film, and electronic product
- Patent Title (中): 形成金属化合物膜和电子产品的方法和装置
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Application No.: US14102792Application Date: 2013-12-11
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Publication No.: US09234275B2Publication Date: 2016-01-12
- Inventor: Yoshihiro Takezawa , Katsushige Harada
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2012-270670 20121211
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/30 ; C23C16/40 ; C23C16/455 ; H01L21/02 ; H01L21/28 ; C23C16/06 ; H01L29/51
Abstract:
Provided is a method of forming a film of metal compound of first and second materials on an object to be processed, one of the first and second materials being metal, which includes: supplying a raw material gas containing the first material to the object such that the first material is adsorbed onto the object; supplying a raw material gas containing the second material to the object with the first material adsorbed thereon such that the second material is adsorbed onto the object with the first material adsorbed thereon; and supplying a third material different from the first and second materials onto the first and second materials adsorbed onto the object such that the first to third materials are chemically combined with one another.
Public/Granted literature
- US20140161706A1 METHOD AND APPARATUS OF FORMING METAL COMPOUND FILM, AND ELECTRONIC PRODUCT Public/Granted day:2014-06-12
Information query
IPC分类:
