发明授权
- 专利标题: Method of forming diamond conditioners for CMP process
- 专利标题(中): 形成CMP工艺用金刚石调理剂的方法
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申请号: US13455448申请日: 2012-04-25
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公开(公告)号: US09254548B2公开(公告)日: 2016-02-09
- 发明人: Yen-Chang Chao , Kei-Wei Chen , Ying-Lang Wang
- 申请人: Yen-Chang Chao , Kei-Wei Chen , Ying-Lang Wang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Duane Morris LLP
- 主分类号: B24B53/017
- IPC分类号: B24B53/017 ; B24D3/06 ; B24D3/28 ; B24D18/00
摘要:
A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process.
公开/授权文献
- US20130288582A1 METHOD OF FORMING DIAMOND CONDITIONERS FOR CMP PROCESS 公开/授权日:2013-10-31