公开(公告)号：US20130102152A1

公开(公告)日：2013-04-25

申请号：US13277609

申请日：2011-10-20

申请人： Yen-Chang CHAO ,  Kei-Wei CHEN ,  Ying-Lang WANG

发明人： Yen-Chang CHAO ,  Kei-Wei CHEN ,  Ying-Lang WANG

IPC分类号： H01L21/306 ,  B24B55/00 ,  H01L21/304 ,  B24B41/06

CPC分类号： B24B37/32

摘要： A semiconductor manufacturing apparatus includes at least one inner retaining ring, and an outer retaining ring. The at least one inner retaining ring applies a first pressure to the polishing pad, and retains a substrate on the polishing pad. The outer retaining ring applies a second pressure to the polishing pad, and retains the at least one inner retaining ring on the polishing pad. Control of the first pressure is independent with respect to control of the second pressure.

摘要翻译： 半导体制造装置包括至少一个内保持环和外保持环。 至少一个内部保持环向抛光垫施加第一压力，并将衬底保持在抛光垫上。 外保持环向抛光垫施加第二压力，并且将至少一个内保持环保持在抛光垫上。 关于第二压力的控制，第一压力的控制是独立的。

公开(公告)号：US07169626B2

公开(公告)日：2007-01-30

申请号：US10944844

申请日：2004-09-21

申请人： Yen-Chang Chao ,  You-Hua Chou ,  Yong-Ping Chan

发明人： Yen-Chang Chao ,  You-Hua Chou ,  Yong-Ping Chan

IPC分类号： H01L31/26

CPC分类号： H01L22/20 ,  H01L22/34 ,  H01L2223/54453

摘要： A method of testing a test wafer includes shielding test centers on a test wafer using shielding tabs during the deposition of a layer. The test wafer has the same size and shape of product wafers. The shielding tabs are then removed from the test wafer. A plurality of predetermined points which are separated from each test center by a critical interval are checked, and whether each point is covered by the layer is determined through an interferometer or a microprobe. The test wafer is processed after adjustments to or maintenance on equipment, or after a fixed number of product wafers have been processed.

摘要翻译： 测试测试晶片的方法包括在沉积层期间使用屏蔽片在测试晶片上屏蔽测试中心。 测试晶片具有相同的尺寸和形状的产品晶片。 然后将屏蔽突片从测试晶片上移除。 检查从每个测试中心分离临界间隔的多个预定点，并且通过干涉仪或微探针确定每个点是否被层覆盖。 测试晶片在对设备进行调整或维护后，或在固定数量的产品晶片进行处理后进行处理。

公开(公告)号：US20050073800A1

公开(公告)日：2005-04-07

申请号：US10678236

申请日：2003-10-03

申请人： You-Hua Chou ,  Yen-Shuo Su ,  Yen-Chang Chao ,  Jain-Shing Tsai ,  Yong-Ping Chan ,  Jung-Chen Yang

发明人： You-Hua Chou ,  Yen-Shuo Su ,  Yen-Chang Chao ,  Jain-Shing Tsai ,  Yong-Ping Chan ,  Jung-Chen Yang

IPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H01G4/38 ,  H01L21/02 ,  H01L23/522

CPC分类号： H01G4/33 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01L23/5223 ,  H01L28/82 ,  H01L2924/0002 ,  Y10T29/435 ,  H01L2924/00

摘要： A capacitor having an electrically/conductive plate, an electrically conductive segmented plate defining a first plurality of electrically conductive plate segments and a second plurality of electrically conductive plate segments, a first capacitor dielectric disposed between the plate and the segmented plate, at least one electrically conductive interconnect coupling each of the plate segments of one of the first and second plurality of plate segments to the plate, and a second capacitor dielectric disposed between the plate segments.

摘要翻译： 具有电/导电板的电容器，限定第一多个导电板段和第二多个导电板段的导电分段板，设置在板和分段板之间的第一电容器电介质，至少一个电 所述导电互连将所述第一和第二多个板段中的一个的每个板段耦合到所述板，以及设置在所述板段之间的第二电容器电介质。

公开(公告)号：US20060063347A1

公开(公告)日：2006-03-23

申请号：US10944844

申请日：2004-09-21

申请人： Yen-Chang Chao ,  You-Hua Chou ,  Yong-Ping Chan

发明人： Yen-Chang Chao ,  You-Hua Chou ,  Yong-Ping Chan

IPC分类号： H01L21/76

CPC分类号： H01L22/20 ,  H01L22/34 ,  H01L2223/54453

摘要： A method of testing a test wafer includes shielding test centers on a test wafer using shielding tabs during the deposition of a layer. The test wafer has the same size and shape of product wafers. The shielding tabs are then removed from the test wafer. A plurality of predetermined points which are separated from each test center by a critical interval are checked, and whether each point is covered by the layer is determined through an interferometer or a microprobe. The test wafer is processed after adjustments to or maintenance on equipment, or after a fixed number of product wafers have been processed.

摘要翻译： 测试测试晶片的方法包括在沉积层期间使用屏蔽片在测试晶片上屏蔽测试中心。 测试晶片具有相同的尺寸和形状的产品晶片。 然后将屏蔽突片从测试晶片上移除。 检查从每个测试中心分离临界间隔的多个预定点，并且通过干涉仪或微探针确定每个点是否被层覆盖。 测试晶片在对设备进行调整或维护后，或在固定数量的产品晶片进行处理后进行处理。

公开(公告)号：US06934143B2

公开(公告)日：2005-08-23

申请号：US10678236

申请日：2003-10-03

申请人： You-Hua Chou ,  Yen-Shuo Su ,  Yen-Chang Chao ,  Jain-Shing Tsai ,  Yong-Ping Chan ,  Jung-Chen Yang

发明人： You-Hua Chou ,  Yen-Shuo Su ,  Yen-Chang Chao ,  Jain-Shing Tsai ,  Yong-Ping Chan ,  Jung-Chen Yang

IPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H01G4/38 ,  H01L21/02 ,  H01L23/522

CPC分类号： H01G4/33 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01L23/5223 ,  H01L28/82 ,  H01L2924/0002 ,  Y10T29/435 ,  H01L2924/00

摘要： A capacitor having an electrically/conductive plate, an electrically conductive segmented electrically conductive plate segments and a second plurality of electrically conductive plate segments, a first capacitor dielectric disposed between the plate and the segment plate, at least one electrically conductive interconnect coupling each of the plate segment of one of the first and second plurality of plate segments to the plate, and a second capacitor dieletric disposed between the plate segments.

摘要翻译： 具有电/导电板的电容器，导电分段的导电板段和第二多个导电板段，设置在板和段板之间的第一电容器电介质，至少一个导电互连， 所述第一和第二多个板段中的一个的板段到所述板，以及设置在所述板段之间的第二电容器。

公开(公告)号：US09254548B2

公开(公告)日：2016-02-09

申请号：US13455448

申请日：2012-04-25

申请人： Yen-Chang Chao ,  Kei-Wei Chen ,  Ying-Lang Wang

发明人： Yen-Chang Chao ,  Kei-Wei Chen ,  Ying-Lang Wang

IPC分类号： B24B53/017 ,  B24D3/06 ,  B24D3/28 ,  B24D18/00

CPC分类号： B24B53/12 ,  B24B53/017 ,  B24D3/06 ,  B24D3/28 ,  B24D18/00

摘要： A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process.

摘要翻译： 用于制造在化学机械抛光（CMP）工艺中使用的调节盘的方法包括在衬底上施加至少一种粘合剂的第一层; 在所述多个位置处在所述至少一个第一粘合剂的所述第一层上设置多个金刚石颗粒; 以及通过将衬底加热到​​升高的温度然后冷却衬底，将多个金刚石颗粒固定到衬底上。 设置在基板上的多个金刚石颗粒被配置为当在CMP工艺中使用调节盘时，提供高于50％的工作金刚石比例。

公开(公告)号：US20130288582A1

公开(公告)日：2013-10-31

申请号：US13455448

申请日：2012-04-25

申请人： Yen-Chang CHAO ,  Kei-Wei CHEN ,  Ying-Lang WANG

发明人： Yen-Chang CHAO ,  Kei-Wei CHEN ,  Ying-Lang WANG

IPC分类号： B24B53/017 ,  B24D3/06 ,  B24D3/28 ,  B24D18/00

CPC分类号： B24B53/12 ,  B24B53/017 ,  B24D3/06 ,  B24D3/28 ,  B24D18/00

摘要： A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process.

摘要翻译： 用于制造在化学机械抛光（CMP）工艺中使用的调节盘的方法包括在衬底上施加至少一种粘合剂的第一层; 在所述多个位置处在所述至少一个第一粘合剂的所述第一层上设置多个金刚石颗粒; 以及通过将衬底加热到​​升高的温度然后冷却衬底，将多个金刚石颗粒固定到衬底上。 设置在基板上的多个金刚石颗粒被配置为当在CMP工艺中使用调节盘时，提供高于50％的工作金刚石比例。