Invention Grant
- Patent Title: Light-emitting diode chip
- Patent Title (中): 发光二极管芯片
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Application No.: US14371722Application Date: 2013-01-15
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Publication No.: US09257596B2Publication Date: 2016-02-09
- Inventor: Martin Straβburg , Enrique Calleja-Pardo , Steven Albert , Ana Maria Bengoechea Encabo , Miguel Angel Sanchez-Garcia , Martin Mandl , Christopher Kölper
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: McDermott Will & Emery LLP
- Priority: EP12151946 20120120
- International Application: PCT/EP2013/050665 WO 20130115
- International Announcement: WO2013/107737 WO 20130725
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/00 ; H01L33/08 ; H01L27/15 ; H01L33/06 ; H01L33/18 ; H01L33/32

Abstract:
A light-emitting diode chip comprising:—a semiconductor body (1) having a plurality of active regions (2), wherein—at least one of the active regions (2) has at least two subregions (21 . . . 28),—the active region (2) has at least one barrier region (3) arranged between two adjacent subregions (21 . . . 28) of said at least two subregions (21 . . . 28),—the at least two subregions (21 . . . 28) emit light of mutually different colour during operation of the light-emitting diode chip,—in at least one of the subregions (21 . . . 28) the emission of light is generated electrically, and—the barrier region (3) is configured to hinder a thermally activated redistribution of charge carriers between the two adjacent subregions (21 . . . 28), is specified.
Public/Granted literature
- US20140353581A1 LIGHT-EMITTING DIODE CHIP Public/Granted day:2014-12-04
Information query
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