Invention Grant
- Patent Title: Integrated circuit devices including finFETs and methods of forming the same
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Application No.: US14713349Application Date: 2015-05-15
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Publication No.: US09263521B2Publication Date: 2016-02-16
- Inventor: Yeong-Jong Jeong , Jeong-Yun Lee , Shi Li Quan , Dong-Suk Shin , Si-Hyung Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2013-0142211 20131121
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/417 ; H01L29/78 ; H01L29/66 ; H01L27/08 ; H01L27/092 ; H01L27/088

Abstract:
Integrated circuit devices including Fin field effect transistors (finFETs) and methods of forming those devices are provided. The methods may include forming a fin on a substrate and forming a gate line on the fin. The method may also include forming a first recess in the fin having a first width and a first depth and forming a second recess in the first recess having a second width that is less than the first width and having a second depth that is greater than the first depth. The method may further include forming a source/drain region in the first and second recesses.
Public/Granted literature
- US20150249130A1 INTEGRATED CIRCUIT DEVICES INCLUDING FINFETS AND METHODS OF FORMING THE SAME Public/Granted day:2015-09-03
Information query
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