Invention Grant
- Patent Title: Silicon dot formation by direct self-assembly method for flash memory
- Patent Title (中): 通过闪存的直接自组装方法形成硅点
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Application No.: US13974155Application Date: 2013-08-23
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Publication No.: US09281203B2Publication Date: 2016-03-08
- Inventor: Chih-Ming Chen , Cheng-Te Lee , Szu-Yu Wang , Chung-Yi Yu , Chia-Shiung Tsai , Xiaomeng Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/8239
- IPC: H01L21/8239 ; H01L21/28 ; H01L29/423 ; H01L29/788 ; H01L29/792 ; H01L29/66

Abstract:
Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements comprising a substantially equal size within a memory cell. A copolymer solution comprising first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material comprising a regular pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The first or second polymer species is then removed resulting with a pattern of micro-domains or the polymer matrix with a pattern of holes, which may be utilized as a hard-mask to form a substantially identical pattern of discrete storage elements through an etch, ion implant technique, or a combination thereof.
Public/Granted literature
- US20150054059A1 Silicon Dot Formation by Direct Self-Assembly Method for Flash Memory Public/Granted day:2015-02-26
Information query
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