MIM DEVICE WITH LAMINATED DIELECTRIC LAYERS
    1.
    发明申请

    公开(公告)号:US20200098518A1

    公开(公告)日:2020-03-26

    申请号:US16180313

    申请日:2018-11-05

    Abstract: The present disclosure relates to a MIM (metal-insulator-metal) capacitor having a laminated capacitor dielectric layer including alternating layers of high-k dielectric material and high-energy band gap material, and a method of formation. In some embodiments, the MIM capacitor has a laminated capacitor dielectric layer disposed over a capacitor bottom metal layer. The laminated capacitor dielectric layer includes a first layer of a first dielectric material, a second layer of a second dielectric material disposed on top of the first layer, a third layer of a third dielectric material disposed on top of the second layer, and a fourth layer of a fourth dielectric material disposed on top of the third layer. The first and third dielectric materials have a differing capacitance and band gap energy as compared to the second and fourth dielectric materials. A capacitor top metal layer is disposed over the laminated capacitor dielectric layer.

    ENHANCED TRENCH ISOLATION STRUCTURE

    公开(公告)号:US20220123031A1

    公开(公告)日:2022-04-21

    申请号:US17073553

    申请日:2020-10-19

    Abstract: The present disclosure relates to an image sensor comprising a substrate. A photodetector is in the substrate. A trench is in the substrate and is defined by sidewalls and an upper surface of the substrate. A first isolation layer extends along the sidewalls and the upper surface of the substrate that define the trench. The first isolation layer comprises a first dielectric material. A second isolation layer is over the first isolation layer. The second isolation layer lines the first isolation layer. The second isolation layer comprises a second dielectric material. A third isolation layer is over the second isolation layer. The third isolation layer fills the trench and lines the second isolation layer. The third isolation layer comprises a third material. A ratio of a first thickness of the first isolation layer to a second thickness of the second isolation layer is about 0.17 to 0.38.

    Silicon dot formation by direct self-assembly method for flash memory
    4.
    发明授权
    Silicon dot formation by direct self-assembly method for flash memory 有权
    通过闪存的直接自组装方法形成硅点

    公开(公告)号:US09281203B2

    公开(公告)日:2016-03-08

    申请号:US13974155

    申请日:2013-08-23

    Abstract: Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements comprising a substantially equal size within a memory cell. A copolymer solution comprising first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material comprising a regular pattern of micro-domains of the second polymer species within a polymer matrix comprising the first polymer species. The first or second polymer species is then removed resulting with a pattern of micro-domains or the polymer matrix with a pattern of holes, which may be utilized as a hard-mask to form a substantially identical pattern of discrete storage elements through an etch, ion implant technique, or a combination thereof.

    Abstract translation: 本公开的一些实施例涉及一种实现在存储器单元内包括基本相等尺寸的离散存储元件的基本上均匀的图案的方法。 将包含第一和第二聚合物种类的共聚物溶液旋涂在基材的表面上,并进行自组装成相分离的材料,该相分离材料包含第二聚合物物质的规则形式的第二聚合物种类的聚合物基质, 第一种聚合物种类。 然后去除第一或第二聚合物物质,其具有微畴图案或具有空穴图案的聚合物基质,其可以用作硬掩模,以通过蚀刻形成基本相同的离散存储元件图案, 离子注入技术或其组合。

    Enhanced trench isolation structure

    公开(公告)号:US11784204B2

    公开(公告)日:2023-10-10

    申请号:US17073553

    申请日:2020-10-19

    CPC classification number: H01L27/1463 H01L27/14689 H01L27/14698

    Abstract: The present disclosure relates to an image sensor comprising a substrate. A photodetector is in the substrate. A trench is in the substrate and is defined by sidewalls and an upper surface of the substrate. A first isolation layer extends along the sidewalls and the upper surface of the substrate that define the trench. The first isolation layer comprises a first dielectric material. A second isolation layer is over the first isolation layer. The second isolation layer lines the first isolation layer. The second isolation layer comprises a second dielectric material. A third isolation layer is over the second isolation layer. The third isolation layer fills the trench and lines the second isolation layer. The third isolation layer comprises a third material. A ratio of a first thickness of the first isolation layer to a second thickness of the second isolation layer is about 0.17 to 0.38.

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