Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US14097049Application Date: 2013-12-04
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Publication No.: US09288902B2Publication Date: 2016-03-15
- Inventor: Eun Sil Kim , Sung Han Kim , Sa Yong Lee , Jin Ho Hong , Yong Il Kwon , Sang Hyun Shin , Keun Yong Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0100630 20130823
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; G03F7/40 ; H05K3/10 ; H05K3/12 ; H05K1/02 ; H05K3/40 ; H05K3/42
Abstract:
Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.
Public/Granted literature
- US20150053469A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-02-26
Information query
