公开(公告)号：US20180130595A1

公开(公告)日：2018-05-10

申请号：US15642114

申请日：2017-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Woo Choi ,  Jin Ho Hong ,  Il Jong Seo ,  Sa Yong Lee ,  Myung Sam Kang ,  Tae Hong Min

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F17/0033 ,  H01F19/04 ,  H01F27/292 ,  H01F27/303 ,  H01F41/041 ,  H01F2017/004 ,  H01F2027/2809

Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.

公开(公告)号：US20150053469A1

公开(公告)日：2015-02-26

申请号：US14097049

申请日：2013-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Sil Kim ,  Sung Han Kim ,  Sa Yong Lee ,  Jin Ho Hong ,  Yong II Kwon ,  Sang Hyun Shin ,  Keun Yong Lee

IPC: H05K1/03 ,  G03F7/40

CPC classification number: H05K1/0306 ,  G03F7/40 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/426 ,  H05K2201/0376

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括遮光玻璃基板; 形成在所述玻璃基板上的负光敏绝缘层; 以及形成在玻璃基板上并嵌入在负光敏绝缘层中的电路图案。

公开(公告)号：US11488768B2

公开(公告)日：2022-11-01

申请号：US16408746

申请日：2019-05-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sa Yong Lee ,  Myung Sam Kang

IPC: H01F27/32 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04

Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.

公开(公告)号：US10902994B2

公开(公告)日：2021-01-26

申请号：US15988497

申请日：2018-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Seong Kim ,  Jun Il Kang ,  Sa Yong Lee ,  Gun Hwi Hyung

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F27/32 ,  H01F17/00 ,  H05K1/18

Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.

公开(公告)号：US09899136B2

公开(公告)日：2018-02-20

申请号：US15395075

申请日：2016-12-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Myung Sam Kang ,  Tae Hong Min ,  Seon Ha Kang ,  Mi Sun Hwang ,  Il Jong Seo

IPC: H01F5/00 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H01F41/12

CPC classification number: H01F27/255 ,  H01F5/00 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F41/046 ,  H01F41/10 ,  H01F41/122 ,  H01F2017/048 ,  H01F2027/2809

Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.

公开(公告)号：US20150060115A1

公开(公告)日：2015-03-05

申请号：US14079236

申请日：2013-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Jin Seok Moon ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K3/20 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/036 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/308 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0271 ,  Y10T156/10 ,  Y10T428/249921

Abstract: Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

Abstract translation: 本发明公开了一种用于印刷电路板的覆铜层压板，其中在预浸料坯的两面上形成有玻璃纤维的复合体设置在第一树脂涂覆铜箔（RCC）的树脂层和树脂层 第二种树脂被覆铜箔，其结构是基于该复合物而使树脂层对称或不对称的结构及其制造方法。 覆铜层压板的厚度可以制造成所需的厚度，或者可以均匀地保持厚度，从而可以实现厚度质量的稳定化，可以提高铜箔和树脂之间的粘附性，并且可以调节翘曲 当层压具有不同上和下热膨胀系数的基板时。

公开(公告)号：US11476034B2

公开(公告)日：2022-10-18

申请号：US16029346

申请日：2018-07-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hui Jo ,  Hye Won Jung ,  Sa Yong Lee

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F17/00 ,  H01F17/02

Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

公开(公告)号：US20150050504A1

公开(公告)日：2015-02-19

申请号：US14170359

申请日：2014-01-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/0306 ,  B32B17/064 ,  B32B37/0015 ,  B32B37/02 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2307/41 ,  B32B2315/08 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0393 ,  H05K2201/051 ,  H05K2203/1545

Abstract: Disclosed herein are a core substrate and a method of manufacturing the same. The core substrate includes: a glass substrate made of an insulating material and a photosensitive insulating layer formed on at least one of one surface and the other surface of the glass substrate. With the core substrate and the method of manufacturing the same, fine circuit patterns may be formed and generation of a defect such as separation of a circuit pattern may be decreased.

Abstract translation: 这里公开了核心基板及其制造方法。 核心基板包括：由绝缘材料制成的玻璃基板和形成在玻璃基板的一个表面和另一个表面中的至少一个表面上的感光绝缘层。 使用核心基板及其制造方法，可以形成精细的电路图案，并且可能减少诸如电路图案的分离的缺陷的产生。

公开(公告)号：US20140076198A1

公开(公告)日：2014-03-20

申请号：US13735741

申请日：2013-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Young Kim ,  Sa Yong Lee ,  Geum Hee Yun ,  Keun Yong Lee

IPC: C09D163/00

CPC classification number: C09D163/00 ,  C08G59/4021 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L5/08 ,  C08L77/00

Abstract: Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.

Abstract translation: 本发明公开了一种用于绝缘的环氧树脂组合物和使用其制备的绝缘膜，预浸料和印刷电路板，所述环氧树脂组合物包括：几丁质纳米颗粒或几丁质纳米纤维; 液晶低聚物或可溶性液晶热固性低聚物; 环氧树脂; 和无机填料，使得环氧树脂组合物，绝缘膜和预浸料坯可以具有低热膨胀系数，高玻璃化转变温度和高刚性。

公开(公告)号：US11763982B2

公开(公告)日：2023-09-19

申请号：US16206582

申请日：2018-11-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Mi Sun Hwang

IPC: H01F27/32 ,  H01F5/06 ,  H01F27/29 ,  H01F41/12

CPC classification number: H01F27/32 ,  H01F5/06 ,  H01F27/29 ,  H01F41/12

Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.