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    SOLID OXIDE FUEL CELL
    2.
    发明申请
    SOLID OXIDE FUEL CELL 审中-公开
    固体氧化物燃料电池

    公开(公告)号：US20140178793A1

    公开(公告)日：2014-06-26

    申请号：US13844264

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho Chung ,  Sung Han Kim ,  Jong Sik Yoon ,  Bon Seok Koo

    IPC: H01M8/10

    CPC classification number: H01M8/1213 ,  H01M8/243 ,  H01M2008/1293

    Abstract: Disclosed herein is a unit cell including: an internal electrode including a flat upper surface and a lower surface arranged in parallel to face each other and a plurality of internal channels having a flat lower side disposed between the upper surface and the lower surface; an interconnector seated on the upper surface of the internal electrode; an electrolyte laminated on an outer circumferential surface of the internal electrode, except for the interconnector; and an external electrode laminated on an outer circumferential surface of the electrolyte.

    Abstract translation: 本发明公开了一种单元电池，包括：内部电极，包括平行的上表面和下表面，并排布置成彼此面对;多个内部通道，其具有设置在上表面和下表面之间的平坦下侧; 位于内部电极的上表面上的互连器; 除了互连器之外，层压在内部电极的外周面上的电解质; 以及层叠在电解质的外周面上的外部电极。

    Fan-out semiconductor package
    3.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10026703B2

    公开(公告)日：2018-07-17

    申请号：US15679860

    申请日：2017-08-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yun Tae Lee ,  Sung Han Kim ,  Han Kim

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

    Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the first connection member, the dummy chip, and the active surface of the semiconductor chip; and an encapsulant encapsulating at least portions of the first connection member, the dummy chip, and the inactive surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads.

    SOLID OXIDE FUEL CELL ASSEMBLY AND METHOD FOR FORMING SEAL
    5.
    发明申请
    SOLID OXIDE FUEL CELL ASSEMBLY AND METHOD FOR FORMING SEAL 审中-公开
    固体氧化物燃料电池组件和形成密封件的方法

    公开(公告)号：US20140178787A1

    公开(公告)日：2014-06-26

    申请号：US13831623

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho Chung ,  Sung Han Kim ,  Jong Sik Yoon ,  Bon Seok Koo

    IPC: H01M8/02

    CPC classification number: H01M8/0286 ,  H01M8/028 ,  H01M8/2404 ,  H01M8/243 ,  H01M8/2465 ,  H01M8/247 ,  H01M8/2485

    Abstract: Disclosed herein is a solid oxide fuel cell assembly, including: one or more unit cell, a box-shaped housing provided in the unit cell so as to prevent fuel and air from contacting with each other; a metal plate provided with one or more penetration hole in a plate shape partitioning the housing so as to prevent fuel and air from contacting with each other; and a seal sealing a spaced gap between an outer circumferential surface of the unit cell and a penetration hole of a metal plate. The preferred embodiment of the present invention provides the reliable sealed state between the unit cell and the metal plate by using the seal formed of a sealant, a bonding material, and a sealing material.

    Abstract translation: 本文公开了一种固体氧化物燃料电池组件，包括：一个或多个单元电池，设置在单元电池中的盒形壳体，以防止燃料和空气彼此接触; 金属板，其设置有分隔壳体的板状的一个或多个穿透孔，以防止燃料和空气彼此接触; 以及密封单元电池的外周面与金属板的贯通孔之间的间隔开的密封件。 本发明的优选实施例通过使用由密封剂，接合材料和密封材料形成的密封来提供单元和金属板之间的可靠的密封状态。

    Fan-out semiconductor package
    6.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10692818B2

    公开(公告)日：2020-06-23

    申请号：US15923308

    申请日：2018-03-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han Kim ,  Sung Han Kim ,  Seok Hwan Kim

    IPC: H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

    Abstract: A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member and having openings exposing at least portions of the redistribution layer; metal members disposed in the openings of the passivation layer and connected to the exposed redistribution layer; and electrical connection structures disposed on the passivation layer and connected to the metal members, wherein the electrical connection structures have heights hierarchically differentiated from one another depending on sizes of the metal members.

    Electronic component package and electronic device including the same
    7.
    发明授权
    Electronic component package and electronic device including the same 有权

    公开(公告)号：US10032697B2

    公开(公告)日：2018-07-24

    申请号：US15203006

    申请日：2016-07-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han Kim ,  Young Gwan Ko ,  Kang Heon Hur ,  Kyung Moon Jung ,  Sung Han Kim

    IPC: H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00

    Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.

    Thermoelectric module and method for manufacturing the same
    10.
    发明授权
    Thermoelectric module and method for manufacturing the same 有权

    公开(公告)号：US12295264B2

    公开(公告)日：2025-05-06

    申请号：US17741352

    申请日：2022-05-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Han Kim ,  Se Yeon Hwang ,  Joon Woo Gi ,  Jong Ho Chung ,  Han Kim

    IPC: H10N10/17 ,  H10N10/01 ,  H10N10/855

    Abstract: A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.

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