Invention Grant
- Patent Title: Substrate spreading device for vacuum processing apparatus, vacuum processing apparatus with substrate spreading device and method for operating same
- Patent Title (中): 真空处理装置的基板扩散装置，具有基板扩散装置的真空处理装置及其操作方法
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Application No.: US14160121Application Date: 2014-01-21
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Publication No.: US09333525B2Publication Date: 2016-05-10
- Inventor: Florian Ries , Andreas Sauer , Stefan Hein
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Priority: EP13196505 20131210
- Main IPC: C23C14/56
- IPC: C23C14/56 ; C23C16/46 ; C23C16/54 ; B05C9/14 ; B05C13/00 ; B05C9/08 ; B05C1/08 ; B05C1/12 ; B05C15/00 ; B05D3/12 ; C23C16/02 ; C23C14/50 ; C23C16/458 ; C23C16/48 ; H01J37/32 ; B65G23/34 ; G11B5/85
Abstract:
A processing apparatus for processing a flexible substrate, particularly a vacuum processing apparatus for processing a flexible substrate, is described. The processing apparatus includes a vacuum chamber; a processing drum within the vacuum chamber, wherein the processing drum is configured to rotate around an axis extending in a first direction; and a heating device adjacent to the processing drum, wherein the heating device is configured for spreading the substrate in the first direction or for maintaining a spread of the substrate in the first direction, and wherein the heating device has a dimension in a direction parallel to a substrate transport direction of at least 20 mm.
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