公开(公告)号：US10689760B2

公开(公告)日：2020-06-23

申请号：US15351279

申请日：2016-11-14

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Morrison Neil

IPC: C23C16/54 ,  C23C16/44 ,  C23C16/509 ,  C23C16/455 ,  C23C14/56

Abstract: An apparatus for processing a flexible substrate is provided including a vacuum chamber having a first chamber portion, second chamber portion and third chamber portion. The apparatus further includes an unwinding shaft supporting the flexible substrate to be processed and a winding shaft supporting the flexible substrate after processing, wherein the unwinding shaft and the winding shaft are disposed in the first chamber portion, a first wall separating the first chamber portion from the second chamber portion, wherein the first wall is inclined with respect to a vertical and horizontal orientation, a coating drum having a first portion disposed in the second chamber portion and a second portion disposed in the third chamber portion, and a plurality of processing stations disposed at least partially in the third chamber portion, wherein a majority of the plurality of the processing stations are disposed below a rotational axis of the coating drum.

公开(公告)号：US09333525B2

公开(公告)日：2016-05-10

申请号：US14160121

申请日：2014-01-21

Applicant: Applied Materials, Inc.

Inventor： Florian Ries ,  Andreas Sauer ,  Stefan Hein

IPC: C23C14/56 ,  C23C16/46 ,  C23C16/54 ,  B05C9/14 ,  B05C13/00 ,  B05C9/08 ,  B05C1/08 ,  B05C1/12 ,  B05C15/00 ,  B05D3/12 ,  C23C16/02 ,  C23C14/50 ,  C23C16/458 ,  C23C16/48 ,  H01J37/32 ,  B65G23/34 ,  G11B5/85

CPC classification number: B05C9/08 ,  B05C1/0826 ,  B05C1/12 ,  B05C9/14 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65G23/34 ,  C23C14/50 ,  C23C14/562 ,  C23C16/0209 ,  C23C16/458 ,  C23C16/46 ,  C23C16/481 ,  C23C16/545 ,  G11B5/85 ,  H01J37/3277

Abstract: A processing apparatus for processing a flexible substrate, particularly a vacuum processing apparatus for processing a flexible substrate, is described. The processing apparatus includes a vacuum chamber; a processing drum within the vacuum chamber, wherein the processing drum is configured to rotate around an axis extending in a first direction; and a heating device adjacent to the processing drum, wherein the heating device is configured for spreading the substrate in the first direction or for maintaining a spread of the substrate in the first direction, and wherein the heating device has a dimension in a direction parallel to a substrate transport direction of at least 20 mm.

Abstract translation: 描述了用于处理柔性基板的处理装置，特别是用于处理柔性基板的真空处理装置。 处理装置包括真空室; 所述真空室内的处理滚筒，其中所述处理滚筒被构造成围绕沿第一方向延伸的轴线旋转; 以及与所述处理鼓相邻的加热装置，其中所述加热装置被配置为沿所述第一方向铺展所述基板或者用于在所述第一方向上保持所述基板的扩展，并且其中所述加热装置具有与所述加工装置的方向平行的方向的尺寸 基板输送方向为至少20mm。

公开(公告)号：US09534294B2

公开(公告)日：2017-01-03

申请号：US13965968

申请日：2013-08-13

Applicant: Applied Materials, Inc.

Inventor： Florian Ries ,  Stefan Hein ,  Stefan Lorenz ,  Neil Morrison ,  Tobias Stolley

IPC: C25F1/00 ,  C23C16/44 ,  H01J37/32

CPC classification number: C23C16/4405 ,  H01J37/3277 ,  H01J37/32862 ,  Y10T428/18 ,  Y10T428/192

Abstract: According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

Abstract translation: 根据本公开，提供了一种用于清洁柔性基板处理设备的处理室而不破坏处理室中的真空的方法。 用于清洁处理室的方法包括将牺牲箔引导到处理室中; 在处理室中启动第一泵过程; 等离子体清洁处理室，同时牺牲箔设置在处理室中; 在处理室中启动第二泵过程; 并将柔性基板引导到处理室中。

公开(公告)号：US10648072B2

公开(公告)日：2020-05-12

申请号：US15300321

申请日：2014-04-02

Applicant: Applied Materials, Inc.

Inventor： Florian Ries ,  Stefan Hein ,  Jürgen Henrich ,  Andreas Sauer

IPC: C23C14/52 ,  C23C14/24 ,  C23C14/56 ,  C23C16/54

Abstract: A vacuum processing system for a flexible substrate is provided. The processing system includes a first chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a second chamber adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate; a maintenance zone between the first chamber and the second chamber; and a first process chamber for depositing material on the flexible substrate, wherein the second chamber is provided between the maintenance zone and the first process chamber. The maintenance zone allows for maintenance access to at least one of the first chamber and the second chamber.

公开(公告)号：US09873945B2

公开(公告)日：2018-01-23

申请号：US13871899

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Neil Morrison ,  Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Wolfgang Buschbeck

IPC: C23C16/509 ,  C23C16/54 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/545 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/50 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32568 ,  H01J37/32752 ,  H01J37/32761 ,  H01J37/3277

Abstract: An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.