Invention Grant
- Patent Title: Joining method, joint structure and method for producing the same
- Patent Title (中): 连接方法,接头结构及其制造方法
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Application No.: US14469842Application Date: 2014-08-27
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Publication No.: US09333593B2Publication Date: 2016-05-10
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-048021 20120305
- Main IPC: B23K1/19
- IPC: B23K1/19 ; B23K1/00 ; B23K31/02 ; B23K35/26 ; B23K35/30 ; B23K35/22 ; C22C9/00 ; C22C9/01 ; C22C9/05 ; C22C9/06 ; C22C13/00 ; C22C13/02 ; H05K3/34 ; B23K35/02 ; H01G4/228 ; B23K1/20

Abstract:
A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.
Public/Granted literature
- US20140363221A1 JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2014-12-11
Information query
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